Jeffrey T. Smith
at TEL Technology Ctr America LLC
SPIE Involvement:
Author
Publications (10)

SPIE Journal Paper | July 31, 2018
JM3 Vol. 18 Issue 01
KEYWORDS: Etching, Extreme ultraviolet, Line edge roughness, Optical lithography, Line width roughness, Silicon, Double patterning technology, Dielectrics, Metals, System on a chip

PROCEEDINGS ARTICLE | April 4, 2018
Proc. SPIE. 10589, Advanced Etch Technology for Nanopatterning VII
KEYWORDS: Optical lithography, Etching, Metals, Image processing, Dielectrics, Silicon, Extreme ultraviolet, Line width roughness, Double patterning technology, Line edge roughness

PROCEEDINGS ARTICLE | April 26, 2017
Proc. SPIE. 10147, Optical Microlithography XXX
KEYWORDS: Lithography, Logic, Optical lithography, Etching, Metals, Control systems, Computer simulations, Photomasks, Extreme ultraviolet, Semiconducting wafers, TCAD, Back end of line, Front end of line

PROCEEDINGS ARTICLE | April 7, 2017
Proc. SPIE. 10149, Advanced Etch Technology for Nanopatterning VI
KEYWORDS: Semiconductors, Lithography, Optical lithography, Etching, Metals, Dielectrics, Photomasks, Plasma etching, Double patterning technology, Immersion lithography, Optical alignment, Tolerancing, System on a chip, Overlay metrology, Plasma, Back end of line

PROCEEDINGS ARTICLE | April 7, 2017
Proc. SPIE. 10149, Advanced Etch Technology for Nanopatterning VI
KEYWORDS: Amorphous silicon, Semiconductors, Lithography, Optical lithography, Silica, Etching, Metals, Coating, Materials processing, Photomasks, Extreme ultraviolet, Double patterning technology, High volume manufacturing, System on a chip, Standards development, Tin

PROCEEDINGS ARTICLE | March 24, 2016
Proc. SPIE. 9782, Advanced Etch Technology for Nanopatterning V
KEYWORDS: Amorphous silicon, Lithography, Optical lithography, Etching, Ions, Chemistry, Extreme ultraviolet, Line edge roughness, Back end of line, Front end of line

Showing 5 of 10 publications
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