Dr. Jens Meinschien
Vice President Research and Development at LIMO GmbH
SPIE Involvement:
Publications (15)

Proceedings Article | 4 March 2016 Paper
Dennis Bonsendorf, Stephan Schneider, Jens Meinschien, Jens Tomm
Proceedings Volume 9733, 973302 (2016) https://doi.org/10.1117/12.2205296
KEYWORDS: Semiconductor lasers, High power lasers, Reliability, Laser systems engineering, Semiconductors, Diodes, Optical semiconductors, Optical damage, Materials processing, Solid state lasers, Indium gallium arsenide, Near field optics, Reflectivity, Laser damage threshold, Waveguides

Proceedings Article | 1 July 2015 Paper
E. Fallahi Sichani, D. Hauschild, J. Meinschien, J. Powell, E. Assunção, J. Blackburn, A. Khan, C. Kong
Proceedings Volume 9657, 96570C (2015) https://doi.org/10.1117/12.2179475
KEYWORDS: Laser cutting, Aluminum, Semiconductor lasers, Oxygen, Copper, Nickel, Nitrogen, Surface roughness, Metals, Laser sources

Proceedings Article | 13 March 2015 Paper
Stephan Schneider, Ihab Kardosh, Michael Voß, Sebastian Liebl, Jens Meinschien
Proceedings Volume 9348, 934808 (2015) https://doi.org/10.1117/12.2076265
KEYWORDS: Laser cutting, Metals, Semiconductor lasers, Head, Laser processing, Materials processing, Laser applications, Absorption, Data modeling, High power diode lasers

Proceedings Article | 22 February 2011 Paper
Proceedings Volume 7918, 79180Y (2011) https://doi.org/10.1117/12.875733
KEYWORDS: Semiconductor lasers, High power diode lasers, Beam shaping, Collimation, Laser applications, High power lasers, Fiber coupled lasers, Fiber couplers, Patents, Optical design

Proceedings Article | 25 February 2009 Paper
Proceedings Volume 7202, 72020U (2009) https://doi.org/10.1117/12.809270
KEYWORDS: Beam shaping, Laser sources, Gaussian beams, Laser processing, Silicon, Solar cells, Annealing, Micromachining, Materials processing, Semiconductor lasers

Showing 5 of 15 publications
Conference Committee Involvement (3)
Components and Packaging for Laser Systems III
31 January 2017 | San Francisco, California, United States
Components and Packaging for Laser Systems II
16 February 2016 | San Francisco, California, United States
Components and Packaging for Laser Systems
9 February 2015 | San Francisco, California, United States
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