Dr. Jens Meinschien
Vice President Research and Development at LIMO GmbH
SPIE Involvement:
Conference Program Committee | Author
Publications (15)

Proceedings Article | 4 March 2016
Proc. SPIE. 9733, High-Power Diode Laser Technology and Applications XIV
KEYWORDS: Semiconductors, Indium gallium arsenide, Waveguides, High power lasers, Materials processing, Reliability, Reflectivity, Solid state lasers, Semiconductor lasers, Diodes, Laser damage threshold, Optical damage, Optical semiconductors, Laser systems engineering, Near field optics

Proceedings Article | 1 July 2015
Proc. SPIE. 9657, Industrial Laser Applications Symposium (ILAS 2015)
KEYWORDS: Laser sources, Metals, Copper, Nickel, Nitrogen, Surface roughness, Oxygen, Semiconductor lasers, Aluminum, Laser cutting

Proceedings Article | 13 March 2015
Proc. SPIE. 9348, High-Power Diode Laser Technology and Applications XIII
KEYWORDS: Data modeling, Metals, Laser processing, Materials processing, Laser applications, Semiconductor lasers, Head, Laser cutting, High power diode lasers, Absorption

Proceedings Article | 22 February 2011
Proc. SPIE. 7918, High-Power Diode Laser Technology and Applications IX
KEYWORDS: Optical design, Patents, High power lasers, Laser applications, Semiconductor lasers, Collimation, Beam shaping, Fiber couplers, High power diode lasers, Fiber coupled lasers

Proceedings Article | 25 February 2009
Proc. SPIE. 7202, Laser-based Micro- and Nanopackaging and Assembly III
KEYWORDS: Laser sources, Gaussian beams, Annealing, Solar cells, Silicon, Laser processing, Materials processing, Semiconductor lasers, Micromachining, Beam shaping

Showing 5 of 15 publications
Conference Committee Involvement (3)
Components and Packaging for Laser Systems III
31 January 2017 | San Francisco, California, United States
Components and Packaging for Laser Systems II
16 February 2016 | San Francisco, California, United States
Components and Packaging for Laser Systems
9 February 2015 | San Francisco, California, United States
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