JinYoung Kang
at SAMSUNG Electronics Co Ltd
SPIE Involvement:
Publications (5)

Proceedings Article | 16 March 2016
Proc. SPIE. 9781, Design-Process-Technology Co-optimization for Manufacturability X
KEYWORDS: Metrology, Defect detection, Image processing, Error analysis, Manufacturing, Inspection, Quantitative analysis, Solids, Design for manufacturing, Double patterning technology, Critical dimension metrology, Semiconducting wafers, Design for manufacturability

Proceedings Article | 19 March 2015
Proc. SPIE. 9424, Metrology, Inspection, and Process Control for Microlithography XXIX
KEYWORDS: Reticles, Optical lithography, Sensors, Etching, Composites, Inspection, Scanning electron microscopy, Double patterning technology, Line edge roughness, Semiconducting wafers

Proceedings Article | 18 March 2015
Proc. SPIE. 9427, Design-Process-Technology Co-optimization for Manufacturability IX
KEYWORDS: Lithography, Metrology, Optical lithography, Error analysis, Composites, Inspection, Bridges, Semiconducting wafers, Overlay metrology, Defect inspection

Proceedings Article | 21 May 2004
Proc. SPIE. 5299, Computational Imaging II
KEYWORDS: Principal component analysis, Cameras, Image processing, Video, Video surveillance, Shape analysis, Statistical modeling, Performance modeling, Systems modeling, RGB color model

Proceedings Article | 18 May 2004
Proc. SPIE. 5297, Real-Time Imaging VIII
KEYWORDS: Principal component analysis, Image processing, Video, Video surveillance, Electronic filtering, Motion models, Systems modeling, Filtering (signal processing), Model-based design, Solid modeling

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