JinYoung Kang
at SAMSUNG Electronics Co Ltd
SPIE Involvement:
Publications (5)

Proceedings Article | 16 March 2016
Proc. SPIE. 9781, Design-Process-Technology Co-optimization for Manufacturability X
KEYWORDS: Inspection, Quantitative analysis, Defect detection, Image processing, Solids, Design for manufacturing, Design for manufacturability, Manufacturing, Semiconducting wafers, Error analysis, Critical dimension metrology, Double patterning technology, Metrology

Proceedings Article | 19 March 2015
Proc. SPIE. 9424, Metrology, Inspection, and Process Control for Microlithography XXIX
KEYWORDS: Semiconducting wafers, Inspection, Composites, Scanning electron microscopy, Reticles, Double patterning technology, Sensors, Optical lithography, Etching, Line edge roughness

Proceedings Article | 18 March 2015
Proc. SPIE. 9427, Design-Process-Technology Co-optimization for Manufacturability IX
KEYWORDS: Bridges, Overlay metrology, Inspection, Composites, Metrology, Error analysis, Semiconducting wafers, Optical lithography, Lithography, Defect inspection

Proceedings Article | 21 May 2004
Proc. SPIE. 5299, Computational Imaging II
KEYWORDS: RGB color model, Video, Principal component analysis, Shape analysis, Performance modeling, Video surveillance, Systems modeling, Image processing, Statistical modeling, Cameras

Proceedings Article | 18 May 2004
Proc. SPIE. 5297, Real-Time Imaging VIII
KEYWORDS: Filtering (signal processing), Video, Systems modeling, Video surveillance, Principal component analysis, Electronic filtering, Image processing, Model-based design, Solid modeling, Motion models

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