Dr. Jingwei Wang
at Focuslight Technologies Inc
SPIE Involvement:
Author
Publications (19)

PROCEEDINGS ARTICLE | February 20, 2018
Proc. SPIE. 10513, Components and Packaging for Laser Systems IV
KEYWORDS: High power lasers, Crystals, Laser development, Resistance, Nd:YAG lasers, Solid state lasers, Semiconductor lasers, Heatsinks, Temperature metrology, Absorption

PROCEEDINGS ARTICLE | February 20, 2018
Proc. SPIE. 10513, Components and Packaging for Laser Systems IV
KEYWORDS: Light sources, Cladding, Annealing, Laser processing, Laser applications, Semiconductor lasers, Collimation, Micro optics, Beam shaping, High power diode lasers

PROCEEDINGS ARTICLE | February 22, 2017
Proc. SPIE. 10085, Components and Packaging for Laser Systems III
KEYWORDS: Microfluidics, Copper, Solids, Fluid dynamics

PROCEEDINGS ARTICLE | February 22, 2017
Proc. SPIE. 10085, Components and Packaging for Laser Systems III
KEYWORDS: Packaging, Ceramics, Indium, Semiconductor lasers, Thermal effects, Finite element methods, Thermal analysis, High power diode lasers, Pulsed laser operation

PROCEEDINGS ARTICLE | February 22, 2017
Proc. SPIE. 10085, Components and Packaging for Laser Systems III
KEYWORDS: Copper, Near field, Chemical weapons, Heatsinks

PROCEEDINGS ARTICLE | February 20, 2017
Proc. SPIE. 10123, Novel In-Plane Semiconductor Lasers XVI
KEYWORDS: Packaging, Mirrors, Continuous wave operation, Solid state lighting, High power lasers, Reliability, Semiconductor lasers, Near field, Quasi continuous wave operation, Pulsed laser operation, Failure analysis

Showing 5 of 19 publications
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