Dr. Jinlong Zhu
Postdoc Researcher at Univ of Illinois
SPIE Involvement:
Author
Area of Expertise:
nanophotonics , optical scatterometry , nanoimaging , optical wafer defect inspection , bioimaging , metasurface
Profile Summary

I developed a complete set of optical critical dimension (OCD) metrology approaches for the in-line monitoring of sub-22 nm node semiconductor transistors.

I proposed a robust OCD metrology strategy for the in-chip metrology of dynamic random access memory (DRAM), which achieved the highest measurement accuracy so far.

I am currently working on the label-free super-resolution imaging for living organisms and super-enhanced OCD metrology and defect inspection systems for the in-line monitoring of next-generation semiconductor transistors and quantum dots used in next generation flexible displays. To achieve these goals, I am fusing a diverse portfolio of technologies, including semi-analytic electromagnetic modeling, surface plasmon resonance, inverse optimization, engineered materials, semiconductor fabrication processes, optical waveguides, high numerical aperture imaging, engineering optics, and high precision micro- positioning.

My research interests include optical metrology, optical inspection, nanophotonics, bioimaging, novel optical instruments for super-resolution imaging, and metasurface.
Publications (3)

Proceedings Article | 13 March 2018 Presentation + Paper
Proceedings Volume 10585, 1058508 (2018) https://doi.org/10.1117/12.2297443
KEYWORDS: Semiconducting wafers, Defect inspection, Signal to noise ratio, Inspection, Near field optics, Wafer-level optics, Silicon, Scanning electron microscopy, Defect detection, Microscopes

Proceedings Article | 8 March 2016 Paper
Proceedings Volume 9778, 977823 (2016) https://doi.org/10.1117/12.2218988
KEYWORDS: Process control, Wafer-level optics, Scatterometry, Metrology, Nanostructures, Error analysis, Silicon, Optical testing, Inverse optics, Inverse problems, Scatter measurement

Proceedings Article | 8 March 2016 Paper
Proceedings Volume 9778, 97780P (2016) https://doi.org/10.1117/12.2218979
KEYWORDS: Silicon, Electromagnetism, Semiconducting wafers, Defect inspection, Defect detection, Wafer-level optics, Inspection, Computer simulations, Scattering, Bridges, Signal detection, Polarization, Imaging systems, Near field optics

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