Dr. Jinlong Zhu
Postdoc Researcher at Univ of Illinois
SPIE Involvement:
Author
Area of Expertise:
nanophotonics , optical scatterometry , nanoimaging , optical wafer defect inspection , bioimaging , metasurface
Profile Summary

I developed a complete set of optical critical dimension (OCD) metrology approaches for the in-line monitoring of sub-22 nm node semiconductor transistors.

I proposed a robust OCD metrology strategy for the in-chip metrology of dynamic random access memory (DRAM), which achieved the highest measurement accuracy so far.

I am currently working on the label-free super-resolution imaging for living organisms and super-enhanced OCD metrology and defect inspection systems for the in-line monitoring of next-generation semiconductor transistors and quantum dots used in next generation flexible displays. To achieve these goals, I am fusing a diverse portfolio of technologies, including semi-analytic electromagnetic modeling, surface plasmon resonance, inverse optimization, engineered materials, semiconductor fabrication processes, optical waveguides, high numerical aperture imaging, engineering optics, and high precision micro- positioning.

My research interests include optical metrology, optical inspection, nanophotonics, bioimaging, novel optical instruments for super-resolution imaging, and metasurface.
Publications (3)

Proceedings Article | 13 March 2018
Proc. SPIE. 10585, Metrology, Inspection, and Process Control for Microlithography XXXII
KEYWORDS: Wafer-level optics, Signal to noise ratio, Microscopes, Defect detection, Silicon, Inspection, Scanning electron microscopy, Semiconducting wafers, Near field optics, Defect inspection

Proceedings Article | 8 March 2016
Proc. SPIE. 9778, Metrology, Inspection, and Process Control for Microlithography XXX
KEYWORDS: Wafer-level optics, Nanostructures, Metrology, Error analysis, Silicon, Optical testing, Scatterometry, Inverse problems, Process control, Scatter measurement, Inverse optics

Proceedings Article | 8 March 2016
Proc. SPIE. 9778, Metrology, Inspection, and Process Control for Microlithography XXX
KEYWORDS: Wafer-level optics, Defect detection, Polarization, Imaging systems, Scattering, Silicon, Inspection, Computer simulations, Bridges, Semiconducting wafers, Signal detection, Electromagnetism, Near field optics, Defect inspection

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