In order to address new technology requirements, Spray Photoresist Dispense Processing has been developed to aid in the manufacturing of High Aspect Ratio devices. The choice of process pump to affect the Spray Process is critical to the results, as the dispense uniformity is greatly influenced by the type of pump used to supply fluid to the Ultra Sonic dispense nozzle. Previous methods used had insufficient ramp rate of the dispense output. The pressure on demand dispense unit has excellent ramp rate to required flow rate, and the Patented Control Technology provides stability within tolerance to improve overall uniformity. The implementation of this method will improve cycle time and reduce the processing cost of wafers.