The semiconductor industry continues to accelerate its pace following the SIA roadmap. Many technical and business issues are exacerbated by this acceleration. One such obstacle that faces the mask making community touches on both the business and the technical aspects of the industry's desire to pull in the target dates for each roadmap node. In order to provide the industry with adequate high end capacity on a global basis, the multi-site global photomask company must routinely exercise inter-site transfer for the purpose of leveling the manufacturing loads during periods of peak regional demand. A crucial part of inter-site transfer is to ensure that common standards are used, the deviation from those standards are understood, and a statistics based methodology for correlating metrology equipment is developed. Minimizing critical dimension correlation deltas between sites is critical to successful load leveling in an era of ever shrinking error budgets. This paper will explore the methods and practices used by Photronics to achieve routine inter-site measurements correlations whose precision far exceeds those of the best available standards. Both the statistical methods employed and the results from a large sample of production plates will be reported.
SC579: Photomask Fabrication and Technology Basics
This course provides attendees with a working knowledge of photomask technology. The course focuses on process flow with emphasis in the challenges associated with design data conversions, lithography, process, metrology, inspection, and advanced mask manufacture. Although an entry-level course, the following topics are reviewed in considerable detail:
o Design Data conversion tools and conversion strategies
o Patterning Technologies (e-beam and laser) and key resolution and write time drivers
o Advanced Mask Processing (Bake, Develop, Etch, CAR)
o Mask Materials (NTAR, etc.)
Other topics such as the application of SPC, signature matching, Phase Shifting Masks, and Imprint Templates will also be covered.