The steady-state and transient behaviors of packaged IR LED arrays have been studied via numerical simulations. The
waste heat generated by LEDs must be removed through a cold plate or a cryogenic cold finger attached to the backside
of the driver array. Therefore, this heat must travel across the LED array-driver interface and through the driver array.
The modeling results demonstrate that the thermal resistance of these components can be significant. The steady-state
temperature profiles across several configurations are used to identify the thermal bottlenecks. Transient simulations are
used to quantify the rise and fall times of the IR LEDs, and the fall times can be significantly reduced by changes in the
LED layout. These proposed guidelines to minimize thermal issues in LED arrays should result in better performing and
more reliable IR LED arrays.