Dr. John C. McNulty
Principal Engineer at Exponent Inc
SPIE Involvement:
Author
Publications (3)

Proceedings Article | 18 February 2008
Proc. SPIE. 6884, Reliability, Packaging, Testing, and Characterization of MEMS/MOEMS VII
KEYWORDS: Microelectromechanical systems, Packaging, Actuators, Tunable lasers, Silicon, Reliability, Telecommunications, Tunable filters, Semiconducting wafers, Standards development

Proceedings Article | 7 February 2007
Proc. SPIE. 6456, High-Power Diode Laser Technology and Applications V
KEYWORDS: Packaging, Thermography, Waveguides, Indium, Reliability, Resistance, Laser welding, Semiconductor lasers, Diodes, Heatsinks

Proceedings Article | 7 February 2007
Proc. SPIE. 6456, High-Power Diode Laser Technology and Applications V
KEYWORDS: Packaging, Data modeling, Indium, Reliability, Semiconductor lasers, Finite element methods, Diodes, Thermal modeling, Temperature metrology

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