John A. Redmond
at Univ of Michigan
SPIE Involvement:
Author
Publications (2)

Proceedings Article | 28 March 2009
Proc. SPIE. 7290, Industrial and Commercial Applications of Smart Structures Technologies 2009
KEYWORDS: Packaging, Actuators, Nano opto mechanical systems, Data modeling, Analytical research, Motion models, Motion measurement, Motion analysis, Performance modeling, Shape memory alloys

Proceedings Article | 1 April 2008
Proc. SPIE. 6930, Industrial and Commercial Applications of Smart Structures Technologies 2008
KEYWORDS: Packaging, Actuators, Data modeling, Manufacturing, Chemical elements, Motion models, Motion measurement, Performance modeling, Shape memory alloys, Instrument modeling

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