Dr. John L. Zyskind Profile

Dr. John L. Zyskind

Director, System Engineering at Oclaro Inc

SPIE Involvement:

Author

Publications (4)

Proceedings Article | 23 March 1993 Paper

Effect of pumping configuration on noise figure and efficiency for 0.98-um-pumped saturated erbium-doped fiber amplifiers

Richard Smart, John Zyskind, James Sulhoff, David DiGiovanni

Proceedings Volume 1789, (1993) https://doi.org/10.1117/12.141132

KEYWORDS: Amplifiers, Interference (communication), Optical amplifiers, Fiber amplifiers, Signal detection, Polarization, Quantum efficiency, Wavelength division multiplexing, Bandpass filters, Fiber lasers

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Proceedings Article | 1 February 1992 Paper

Length dependence of saturation power in erbium-doped fiber amplifiers

John Zyskind, James Sulhoff, David DiGiovanni

Proceedings Volume 1581, (1992) https://doi.org/10.1117/12.134990

KEYWORDS: Optical amplifiers, Fiber amplifiers, Amplifiers, Fiber lasers, Semiconductor optical amplifiers, Transparency, Chemical species, Semiconductor lasers, Multiplexers, Fiber couplers

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Proceedings Article | 1 February 1992 Paper

Erbium-doped fiber amplifiers

John Zyskind

Proceedings Volume 1581, (1992) https://doi.org/10.1117/12.134968

KEYWORDS: Optical amplifiers, Fiber amplifiers, Interference (communication), Diodes, Erbium, Telecommunications, Absorption, Signal to noise ratio, Optical communications, Fiber lasers

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Proceedings Article | 1 January 1991 Paper

Advances in Erbium-doped fiber amplifiers for optical communications

John Zyskind

Proceedings Volume 1373, (1991) https://doi.org/10.1117/12.24931

KEYWORDS: Optical amplifiers, Fiber amplifiers, Semiconductor lasers, Optical communications, Erbium, Ions, Fiber lasers, Absorption, Amplifiers, Luminescence

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Conference Committee Involvement (4)

Asia Communications and Photonics

2 November 2009 | Shanghai, China

Passive Components and Fiber-based Devices III

5 September 2006 | Gwangju, South Korea

Passive Components and Fiber-based Devices II

7 November 2005 | Shanghai, China

Passive Components and Fiber-Based Devices

9 November 2004 | Beijing, China

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