Johnson Chiang
Sr. Engineer at Cepheid
SPIE Involvement:
Author
Publications (3)

Proceedings Article | 11 July 2002 Paper
Proc. SPIE. 4700, Smart Structures and Materials 2002: Smart Electronics, MEMS, and Nanotechnology
KEYWORDS: Packaging, Microsystems, Polymers, Silicon, Manufacturing, Epoxies, Semiconducting wafers, Adhesives, Wafer bonding, Wafer dicing

Proceedings Article | 19 August 1999 Paper
Proc. SPIE. 3877, Microfluidic Devices and Systems II
KEYWORDS: Packaging, Microfluidics, Biomedical optics, Polymers, Metals, Silicon, Oxygen, Adhesives, Prototyping, Liquids

Proceedings Article | 19 August 1999 Paper
Proc. SPIE. 3877, Microfluidic Devices and Systems II
KEYWORDS: Polyurethane, Microfluidics, Polymers, Glasses, Silicon, Surface roughness, Scanning electron microscopy, Epoxies, Microfabrication, Liquids

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