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Jong Wook Roh
at Yonsei Univ
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Publications (1)
Proceedings Article | 24 February 2006 Paper
Wafer bonding between InP and Ce:YIG(CeY2Fe5O12) using O2 plasma surface activation for an integrated optical waveguide isolator
T. Mizumoto, D. Woo, S. Lee, J. Roh, Y. Jhon, W. Lee, J. Yang, S. Ok, Y. Byun
Proceedings Volume 6123, 612316 (2006) https://doi.org/10.1117/12.648371
KEYWORDS: Plasma, Wafer bonding, Waveguides, Optical isolators, Heat treatments, Integrated optics, Semiconducting wafers, Interfaces, Surface roughness, Garnet
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