Dr. Julian P. Bristow Profile

Dr. Julian P. Bristow

Senior Manager at Honeywell Aerospace

SPIE Involvement:

Publications (30)

SPIE Conference Volume | June 3, 2002

Optoelectronic Interconnects, Integrated Circuits, and Packaging

PROCEEDINGS ARTICLE | April 13, 1999

Progress in short-distance (0.5 m to 100 m) optical interconnects

Proc. SPIE. 3632, Optoelectronic Interconnects VI

KEYWORDS: Transceivers, Switches, Clocks, Copper, Interfaces, Computing systems, Optoelectronics, Vertical cavity surface emitting lasers, Connectors, Optical interconnects

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SPIE Conference Volume | April 13, 1999

Optoelectronic Interconnects VI

SPIE Conference Volume | May 5, 1998

Optoelectronic Interconnects V

PROCEEDINGS ARTICLE | October 17, 1997

Radiation-induced effects research in emerging photonic technologies: vertical cavity surface emitting lasers, GaN light-emitting diodes, and microelectromechanical devices

Proc. SPIE. 3124, Photonics for Space Environments V

KEYWORDS: Microelectromechanical systems, Actuators, Oxides, Mirrors, Light emitting diodes, Ions, Gallium nitride, Gamma radiation, Vertical cavity surface emitting lasers, Radiation effects

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PROCEEDINGS ARTICLE | July 29, 1997

Polyimide-based waveguides for guided-wave multi-Gbit/sec MCM optoelectronic interconnects

Proc. SPIE. 10290, Sol-Gel and Polymer Photonic Devices: A Critical Review

KEYWORDS: Waveguides, Sensors, Signal attenuation, Silicon, Computing systems, Optoelectronics, Signal processing, Optical clocks, Vertical cavity surface emitting lasers, Signal detection

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We present the fabrication of polyimide-based H-tree waveguides for a multi-GBit/sec optical clock signal distribution in a Si CMOS process compatible environment. Such a clock distribution system is to replace the existing electronic counterpart associated with high-performance computers. A waveguide propagation loss of 0.21 dB/cm at 850 nm was experimentally confirmed for the l-to-48 waveguide fanout device, l-to-2 splitting loss and bending loss were measured to be 0.25 dB and higher. The planarization requirement of the optical interconnection layer among many electrical interconnection layers makes the employment of tilted grating a choice of desire. Theoretical calculation predicts the 1-to-l free-space to waveguide coupling with an efficiency as high as 95%. Currently, a coupling efficiency of 35% was experimentally confirmed due to the limited index difference between guiding and cladding layers. Further experiments aimed at structuring a larger guiding/cladding layer index differences are under investigation. To effectively couple an optical signal into the waveguide through the tided grating coupler, the accuracy of the wavelength employed is pivotal. This makes the usage of the vertical cavity surface-emitting lasers (VCSELs) and VCSEL arrays the best choice when compared with edge-emitting lasers. Modulation bandwidth as high as 6 GBit/sec was demonstrated at 850 nm. Such a wavelength is compatible with Si-based photodetectors. Temperature dependence of the threshold current up to 155 °C was measured which will determine the power dissipation issue of the optoelectronic packaging. Finally, the first fully monolithic Si-MOSFET integrated receiver was made as the optical clock signal detector. To further enhance the bandwidth of such a detector, a resonant cavity structure with Si/Si02 as the bottom mirror was employed. The measured demodulation bandwidth is over 10 GHz. A fully integrated guided-wave optical clock signal distribution system having planarized grating couplers, H-tree Si- CMOS process compatible waveguides, VCSELs and Si-based photo-receivers will be demonstrated in the near future.

PROCEEDINGS ARTICLE | July 29, 1997

Advancement of photonic interconnects for spaceborne systems

Proc. SPIE. 10288, Advancement of Photonics for Space: A Critical Review

KEYWORDS: Packaging, Clocks, Fiber optics, Sensors, Optoelectronics, Optoelectronic devices, Vertical cavity surface emitting lasers, Connectors, Electromagnetic coupling, Optical interconnects

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PROCEEDINGS ARTICLE | May 1, 1997

Vertical-cavity surface-emitting lasers: the applications

Proc. SPIE. 3004, Fabrication, Testing, and Reliability of Semiconductor Lasers II

KEYWORDS: Packaging, Optical fibers, Light emitting diodes, Waveguides, Sensors, Polymers, Computing systems, Vertical cavity surface emitting lasers, Data communications, Polymer multimode waveguides

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PROCEEDINGS ARTICLE | April 4, 1997

Recent progress in short-distance optical interconnects

Proc. SPIE. 3005, Optoelectronic Interconnects and Packaging IV

KEYWORDS: Waveguides, Polymers, Interfaces, Wave propagation, Integrated optics, Vertical cavity surface emitting lasers, Connectors, Optical interconnects, System integration, Polymer multimode waveguides

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PROCEEDINGS ARTICLE | April 4, 1997

Design and fabrication of passive optical polymer waveguide components for multimode parallel optical links

Proc. SPIE. 3005, Optoelectronic Interconnects and Packaging IV

KEYWORDS: Optical fibers, Laser sources, Waveguides, Signal attenuation, Polymers, Computer aided design, Chlorine, Optical interconnects, Beam propagation method, Polymer multimode waveguides

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PROCEEDINGS ARTICLE | April 4, 1997

Optoelectronic backplane interconnect technology development (POINT)

Proc. SPIE. 3005, Optoelectronic Interconnects and Packaging IV

KEYWORDS: Packaging, Transmitters, Waveguides, Polymers, Optoelectronics, Optical alignment, Vertical cavity surface emitting lasers, Optical interconnects, Optoelectronic packaging, Polymer multimode waveguides

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PROCEEDINGS ARTICLE | October 18, 1996

Vertical cavity surface emitting lasers for spaceborne photonic interconnects

Proc. SPIE. 2811, Photonics for Space Environments IV

KEYWORDS: Packaging, Optical fibers, Light emitting diodes, Waveguides, Polymers, Optoelectronic devices, Vertical cavity surface emitting lasers, Radiation effects, Optical interconnects, Polymer multimode waveguides

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PROCEEDINGS ARTICLE | September 30, 1996

Polymer optical waveguide technology for multichip modules (MCMs) and board level interconnects

Proc. SPIE. 2891, Integrated Optoelectronics

KEYWORDS: Photodetectors, Waveguides, Polymers, Interfaces, Silicon, Optoelectronic devices, Vertical cavity surface emitting lasers, Connectors, Optical interconnects, Polymer multimode waveguides

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PROCEEDINGS ARTICLE | March 29, 1996

MCM board level optical interconnects using passive polymer waveguides with hybrid optical and electrical multichip module packaging

Proc. SPIE. 2691, Optoelectronic Packaging

KEYWORDS: Packaging, Waveguides, Cladding, Polymers, Interfaces, Optoelectronics, Optoelectronic devices, Vertical cavity surface emitting lasers, Optical interconnects, Polymer multimode waveguides

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PROCEEDINGS ARTICLE | January 30, 1996

Polymer optical interconnect technology (POINT): optoelectronic packaging and interconnect for board and backplane applications

Proc. SPIE. 10284, Optoelectronic Interconnects and Packaging: A Critical Review

KEYWORDS: Packaging, Diffractive optical elements, Polymers, Amplifiers, Computer simulations, Optoelectronics, Optical alignment, Vertical cavity surface emitting lasers, Optical interconnects, Optoelectronic packaging

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PROCEEDINGS ARTICLE | January 30, 1996

Intracomputer optical interconnects: progress and challenges

Proc. SPIE. 10284, Optoelectronic Interconnects and Packaging: A Critical Review

KEYWORDS: Packaging, Clocks, Polymers, Interfaces, Receivers, Optoelectronics, Optoelectronic devices, Connectors, Optical interconnects, Optics manufacturing

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PROCEEDINGS ARTICLE | October 1, 1995

Optical microwave cellular systems for plant automation

Proc. SPIE. 2560, Optical Technology for Microwave Applications VII

KEYWORDS: Transmitters, Stars, Fiber optics, Sensors, Video, Networks, Receivers, Analog electronics, Microwave radiation, Network architectures

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PROCEEDINGS ARTICLE | May 30, 1995

Multimode optical interconnects with low modal noise for spaceborne databusses and commercial computers

Proc. SPIE. 2482, Photonics for Space Environments III

KEYWORDS: Signal to noise ratio, Multimode fibers, Waveguides, Signal attenuation, Interfaces, Interference (communication), Semiconductor lasers, Connectors, Optical interconnects, Visibility

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Acceptance of optical interconnects into spaceborne and ground-based military systems will be limited by the risk and maturity of the technology. Multimode fibers are currently the interconnect medium of choice for military application due to the availability of qualified parts. Multimode optical interconnects also offer lower assembly cost than singlemode interconnects, making them attractive for use in commercial computers. In both applications, modal noise may limit the attainable bit error rate in a digital system. We report on an investigation of the validity of simple expressions for determining modal noise in multimode systems, and consider in particular waveguides supporting fewer modes than typical multimode fibers and waveguides with incomplete modal excitation. We conclude that the simple expressions are valid for losses greater than approximately 0.5 dB per interface, but that the actual signal-to-noise ratio is significantly poorer than that predicted by theory for large displacements of waveguides in which a small fraction of the total modal volume is excited. We describe two simulation techniques for determining the statistics of the transmission associated with a waveguide bend, and find that the simple formula widely used for straight waveguide intersections do not describe curved waveguide interconnects accurately. We also describe a practical demonstration of two optical interconnect systems in which multimode interconnect media incorporating several imperfect interfaces and excited with coherent sources can achieve useful bit error rates in digital systems. In the first interconnect, a fiber optica data bus for satellite use employs six multimode connectors and multimode fiber to transmit data at 1.2 Gbps over distances from 1 meter to 100 meters. In the second interconnect, passive multimode polymide waveguides compatible with intracabinet optical interconnects are used to implement a multichip module (MCM)-to-MCM interconnect in which optoelectronic die are incorporated in a 'chip first' multichip module technology.

PROCEEDINGS ARTICLE | May 30, 1995

Power-over-fiber sensor network

Proc. SPIE. 2482, Photonics for Space Environments III

KEYWORDS: Packaging, Stars, Capacitors, Sensors, Silicon, Semiconductor lasers, Sensor networks, Relays, Microcontrollers, Prototyping

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PROCEEDINGS ARTICLE | April 5, 1995

Cost-effective optoelectronic packaging for multichip modules and backplane level optical interconnects

Proc. SPIE. 2400, Optoelectronic Interconnects III

KEYWORDS: Packaging, Waveguides, Polymers, Interfaces, Manufacturing, Optoelectronics, Optoelectronic devices, Connectors, Optical interconnects, Optics manufacturing

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PROCEEDINGS ARTICLE | April 5, 1995

Polymer-based optical interconnect technology: a route to low-cost optoelectronic packaging and interconnect

Proc. SPIE. 2400, Optoelectronic Interconnects III

KEYWORDS: Packaging, Thin films, Waveguides, Polymers, Computing systems, Electronic components, Optoelectronic devices, Vertical cavity surface emitting lasers, Optical interconnects, Optoelectronic packaging

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PROCEEDINGS ARTICLE | June 8, 1994

Fiber optic MCM for spaceborne applications

Proc. SPIE. 2215, Photonics for Space Environments II

KEYWORDS: Packaging, Signal to noise ratio, Polishing, Fiber optics, Sensors, Interfaces, Fiber lasers, Semiconductor lasers, Connectors, Space operations

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PROCEEDINGS ARTICLE | June 8, 1994

Microsensor networks

Proc. SPIE. 2215, Photonics for Space Environments II

KEYWORDS: Optical fibers, Light emitting diodes, Stars, Sensors, Corrosion, Data transmission, Modulators, Fiber lasers, Sensor networks, Photonics

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PROCEEDINGS ARTICLE | May 2, 1994

Hybrid integration of electrical and optical interconnects

Proc. SPIE. 2153, Optoelectronic Interconnects II

KEYWORDS: Packaging, Thermography, Waveguides, Adaptive optics, Optoelectronics, Optoelectronic devices, Optical alignment, Optical interconnects, Optics manufacturing, Optoelectronic packaging

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PROCEEDINGS ARTICLE | September 15, 1993

Physical interactions between charged particles and optoelectronic devices and the effects on fiber-based data links

Proc. SPIE. 1953, Photonics for Space Environments

KEYWORDS: Indium gallium arsenide, Sensors, Satellites, Particles, Ions, Receivers, Optoelectronic devices, Ionization, Diodes, Environmental sensing

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PROCEEDINGS ARTICLE | September 15, 1993

Component tradeoffs and technology breakpoints for a 50 Mbps to 3.2 Gbps fiber optic data bus for space applications

Proc. SPIE. 1953, Photonics for Space Environments

KEYWORDS: Signal to noise ratio, Light emitting diodes, Fiber optics, Sensors, Particles, Interfaces, Receivers, Fiber lasers, Photonics, Connectors

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PROCEEDINGS ARTICLE | July 1, 1993

Progress and status of guided-wave optical interconnection technology

Proc. SPIE. 1849, Optoelectronic Interconnects

KEYWORDS: Waveguides, Fiber optics, Polymers, Interfaces, Silicon, Optoelectronic devices, Connectors, Optical interconnects, Tolerancing, Information operations

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PROCEEDINGS ARTICLE | February 9, 1993

Optical express routers for enhanced mesh throughput

Proc. SPIE. 1784, High-Speed Fiber Networks and Channels II

KEYWORDS: Optical fibers, Logic, Switches, Optical amplifiers, Waveguides, Interfaces, Receivers, Control systems, Signal processing, Channel projecting optics

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PROCEEDINGS ARTICLE | April 1, 1991

High-density waveguide modulator arrays for parallel interconnection

Proc. SPIE. 1389, Microelectronic Interconnects and Packages: Optical and Electrical Technologies

KEYWORDS: Packaging, Waveguides, Polarization, Modulators

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PROCEEDINGS ARTICLE | April 1, 1991

Optical interconnects for parallel processing

Proc. SPIE. 1389, Microelectronic Interconnects and Packages: Optical and Electrical Technologies

KEYWORDS: Switches, Waveguides, Single mode fibers, Parallel processing, Modulators, Optical networks, Optical switching, Optical interconnects, Optical arrays, Network architectures

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Showing 5 of 30 publications

Conference Committee Involvement (4)

Optoelectronic Interconnects IX

23 January 2002 | San Jose, California, United States

Optoelectronic Interconnects VI

27 January 1999 | San Jose, CA, United States

Optoelectronic Interconnects V

28 January 1998 | San Jose, CA, United States

Optoelectronic Modules for Aerospace and Automotive Applications

8 February 1997 | San Jose, CA, United States

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