Mr. Jun Cheng
at Chinese Univ of Hong Kong
SPIE Involvement:
Author
Publications (6)

SPIE Journal Paper | May 1, 2008
OE Vol. 47 Issue 05
KEYWORDS: Optical design, Inspection, Projection systems, Modulation transfer functions, Binary data, Lens design, Tolerancing, Optical engineering, Distortion, Semiconducting wafers

PROCEEDINGS ARTICLE | February 9, 2006
Proc. SPIE. 6070, Machine Vision Applications in Industrial Inspection XIV
KEYWORDS: Sensors, Calibration, Error analysis, Inspection, Distortion, 3D modeling, Corner detection, Semiconducting wafers, Binary data, Structured light

PROCEEDINGS ARTICLE | February 9, 2006
Proc. SPIE. 6070, Machine Vision Applications in Industrial Inspection XIV
KEYWORDS: Fringe analysis, Edge detection, Image compression, Sensors, Calibration, Inspection, Reflectivity, Semiconducting wafers, Binary data, 3D image processing

PROCEEDINGS ARTICLE | January 26, 2006
Proc. SPIE. 6056, Three-Dimensional Image Capture and Applications VII
KEYWORDS: Optical design, Inspection, Lens design, 3D modeling, Projection systems, Modulation transfer functions, Semiconducting wafers, Tolerancing, Optics manufacturing, Binary data

PROCEEDINGS ARTICLE | February 24, 2005
Proc. SPIE. 5679, Machine Vision Applications in Industrial Inspection XIII
KEYWORDS: Light sources, 3D image reconstruction, Imaging systems, Cameras, Sensors, Inspection, 3D modeling, Ronchi rulings, Semiconducting wafers, Binary data

Showing 5 of 6 publications
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