The most common method of making white light emitting diode (LED) is to mix the blue light from the LED die and the
wavelength converted yellow light from the phosphor layer. The color conversion efficiency depends on the geometry
and concentration of the phosphor layer including phosphor material. Thus the optimization of the phosphor geometry
and concentration make increase the luminous efficiency of the white LED. In this paper, the remote phosphor scheme is
optimized focusing on increasing the luminous efficiency in high power. The phosphor layer is separated by the silicone
resin from the LED die. The silicone resin covers the LED die with dome shape to increase the extraction efficiency. The
phosphor layer has very large volume with dilute concentration. The separation of phosphor layer from LED die and
very large volumetric dilute phosphor layer were great important role in increasing the luminous flux. The improved
luminous flux was 15% for 1mm<sup>2</sup> LED die at 700mA.
We investigated the dependency of waveguide structures on ripples of far-field patterns in 405nm GaN-based laser diodes theoretically and experimentally. As the n-type cladding layer thickness decreases, the passive waveguide modes strongly interact with an active layer mode. This suggests that the thicknesses of n-AlGaN/GaN superlattice clad and n-GaN waveguide layers have significant influences on FFP ripples. We successfully obtained very smooth far-field patterns perpendicular to the junction plane by optimizing both n-AlGaN/GaN clad layer thickness and n-GaN waveguide layer thickness.
We report on the development of GaN-based violet laser diodes (LDs) for the high-capacity optical storage application and blue LDs for the laser projection display application. InGaN LDs with emission wavelength of ~405 nm are already being adopted for next-generation optical-storage systems. We present results on >400 mW single-mode output power under pulsed operation which can be employed in 100 Gbyte multi-layer BD systems. We designed LD layer structures to exhibit high level of catastrophic optical damage (COD) and small beam divergence. In addition, GaN-based blue LDs with emission wavelength of ~450 nm have also been developed for the application to the blue light sources of laser display systems. We demonstrate single-mode blue InGaN LDs with >100 mW CW output power. Interestingly, we observed anomalous temperature characteristics from the blue InGaN LDs, which has shown highly-stable temperature dependence of output power or even negative characteristic temperature (T<sub>0</sub>) in a certain operation temperature range. This unusual temperature characteristic is attributed to originate from unique carrier transport properties of InGaN QWs with high In composition, which is deduced from the simulation of carrier density and optical gain.
The enhanced output power with improved lifetime is required for the GaN-based blue-violet laser diode (LD) as a light source for Blu-ray Disc or HD-DVD. In this paper, the output power levels and aging behaviors in GaN-based LDs grown on sapphire substrates were compared in epi-up and epi-down bonding. At low current level, the two bondings
show little differences in L-I characteristics. At high current level, however, the epi-up bonding shows a rapidly decreased slope efficiency in L-I characteristics with increasing current injection. On the contrary, the slope efficiency in epi-down bonding is not so much deteriorating as that in epi-up bonding. The differences in junction temperature between epi-up and epi-down bonding are large at higher current levels. The junction temperature of epi-up bonding is
about two times higher than that of epi-down bonding, implying efficient heat dissipation in epi-down bonding. At aging test, the epi-down bonding LD shows lower degradation rate at the aging slope than that of epi-up bonding LD. The degradation rate is accelerated by poor heat dissipation in epi-up bonding. Thus, for the higher power and longer lifetime, it is necessary to employ efficient heat dissipation structures such as epi-down bonding for the GaN-based LD
on sapphire substrate.
With increasing demands for the development of high power GaN-based blue-violet laser diodes (LDs), thermal management has become an important issue. We present a new method to determine junction temperature of GaN-based LDs for simple, fast, and reliable characterization of thermal performances. The large change of forward operation voltage with temperature is advantageously used to measure junction temperature. Using this method, we compare junction temperature of LD structures with different substrates and chip mounting methods. It is found that the junction temperature can be reduced considerably by employing GaN substrates or epi-down bonding. For epi-down bonded LDs, as much as two-fold reduction in junction temperature is achieved compared to epi-up bonded ones and temperature increase in this case is only about 13 degrees for more than 100 mW-output power.