In automated Tape substrate (TS) inspection, machine vision is widely adopted for their high throughput and cost
advantages. However, conventional methods are overly sensitive to foreign particles or have limitations in detecting
three dimensional defects such as top over-etching. In an attempt to complement vision inspection systems, we proposed
utilizing x-ray inspection. To implement x-ray inspection in TS application, we developed a prototype fast and high
spatial resolution x-ray imaging sensor which functions at frame rate in excess of 30 fps and has a spatial resolution of
20 µm. In this paper, the development of the sensor and its performance is addressed and the efficiency of the x-ray
inspection in detecting top over-etching defects will be shown with experimental studies.