Dr. Kaidong Xu
Section Manager, Etch at IMEC
SPIE Involvement:
Author
Publications (5)

SPIE Journal Paper | March 5, 2015
JM3 Vol. 14 Issue 01
KEYWORDS: Etching, Line width roughness, Double patterning technology, Critical dimension metrology, Amorphous silicon, Fin field effect transitor, Plasma, Extreme ultraviolet, Optical lithography, Photomasks

PROCEEDINGS ARTICLE | August 28, 2014
Proc. SPIE. 9167, Spintronics VII
KEYWORDS: Lithography, Optical lithography, Switching, Ferromagnetics, Electrodes, Annealing, Resistance, Magnetism, Extreme ultraviolet, Deposition processes

PROCEEDINGS ARTICLE | March 28, 2014
Proc. SPIE. 9054, Advanced Etch Technology for Nanopatterning III
KEYWORDS: Amorphous silicon, Optical lithography, Etching, Silicon, Photoresist materials, Line width roughness, Extreme ultraviolet lithography, Double patterning technology, Critical dimension metrology, Plasma

SPIE Journal Paper | September 4, 2013
JM3 Vol. 12 Issue 04
KEYWORDS: Line width roughness, Optical lithography, Etching, Line edge roughness, Photomasks, Silicon, Extreme ultraviolet lithography, Plasma, Plasma enhanced chemical vapor deposition, Lithography

PROCEEDINGS ARTICLE | March 29, 2013
Proc. SPIE. 8685, Advanced Etch Technology for Nanopatterning II
KEYWORDS: Lithography, Optical lithography, Etching, Silicon, Photoresist materials, Photomasks, Line width roughness, Extreme ultraviolet lithography, Line edge roughness, Plasma

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