Dr. Kamran Eshraghian Profile

Dr. Kamran Eshraghian

SPIE Involvement:

Conference Chair | Conference Program Committee | Author

Publications (24)

SPIE Conference Volume | May 10, 2007

VLSI Circuits and Systems III

PROCEEDINGS ARTICLE | February 23, 2006

The UTCOMS: a wireless video capsule nanoendoscope

Proc. SPIE. 6082, Endoscopic Microscopy

KEYWORDS: Nanotechnology, Transceivers, Light emitting diodes, Surgery, Video, Control systems, Endoscopes, Telecommunications, Antennas, Wireless communications

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PROCEEDINGS ARTICLE | May 7, 2004

Multiphase CGH design of reconfigurable chip or board-level optical interconnection

Proc. SPIE. 5281, Optical Transmission, Switching, and Subsystems

KEYWORDS: Optical design, Holograms, Detection and tracking algorithms, Fourier transforms, Receivers, Computer generated holography, Spatial light modulators, Algorithm development, Optical interconnects, Binary data

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PROCEEDINGS ARTICLE | March 30, 2004

Microphotonics systems: life beyond microelectronics

Proc. SPIE. 5274, Microelectronics: Design, Technology, and Packaging

KEYWORDS: Biomedical optics, Imaging systems, Sensors, Chemical species, Telecommunications, Photonics, Microelectronics, Transistors, Nanophotonics, Molybdenum

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PROCEEDINGS ARTICLE | March 30, 2004

IP validation in remote microelectronics testing

Proc. SPIE. 5274, Microelectronics: Design, Technology, and Packaging

KEYWORDS: Semiconductors, Networks, Field programmable gate arrays, Computer programming, Computer simulations, Microelectronics, System integration, System on a chip, Standards development, Information operations

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SPIE Conference Volume | March 30, 2004

Microelectronics: Design, Technology, and Packaging

PROCEEDINGS ARTICLE | March 30, 2004

Determination of junction depth and related current phenomena using laser-beam-induced current

Proc. SPIE. 5274, Microelectronics: Design, Technology, and Packaging

KEYWORDS: Modeling, Mercury cadmium telluride, Diffusion, Mercury, Zinc, Physics, Photodiodes, Semiconductor lasers, Plasma, Instrument modeling

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PROCEEDINGS ARTICLE | March 25, 2004

Tunable optical filters employing microphotonics

Proc. SPIE. 5277, Photonics: Design, Technology, and Packaging

KEYWORDS: Optical filters, Holograms, Holography, Reflectivity, Collimators, Liquid crystals, Very large scale integration, Free space optics, Tunable filters, Filtering (signal processing)

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PROCEEDINGS ARTICLE | March 25, 2004

Microphotonic interference mitigation filter for radio astronomy telescopes

Proc. SPIE. 5277, Photonics: Design, Technology, and Packaging

KEYWORDS: Optical components, Telescopes, Optical filters, Diffractive optical elements, Digital filtering, Signal processing, Optical resonators, Electronic filtering, Filtering (signal processing), Phased array optics

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PROCEEDINGS ARTICLE | March 25, 2004

Adaptive power distribution in an optical access network

Proc. SPIE. 5277, Photonics: Design, Technology, and Packaging

KEYWORDS: Optical fibers, Holograms, Optical amplifiers, Coarse wavelength division multiplexing, Networks, Receivers, Adaptive optics, Spatial light modulators, Optical networks, Network architectures

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PROCEEDINGS ARTICLE | April 21, 2003

Iterative current mode per pixel ADC for 3D SoftChip implementation in CMOS

Proc. SPIE. 5117, VLSI Circuits and Systems

KEYWORDS: Mirrors, Sensors, Indium, Telecommunications, Transistors, Multimedia, Analog electronics, System integration, Array processing, Mobile communications

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PROCEEDINGS ARTICLE | November 21, 2001

Digital vision sensor with pixel level analog-to-digital converter

Proc. SPIE. 4591, Electronics and Structures for MEMS II

KEYWORDS: Photodetectors, CMOS sensors, Cadmium, Capacitors, Imaging systems, Sensors, Photodiodes, Image sensors, Frequency modulation, CMOS technology

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PROCEEDINGS ARTICLE | November 21, 2001

Australian national networked tele-test facility for integrated systems

Proc. SPIE. 4591, Electronics and Structures for MEMS II

KEYWORDS: Semiconductors, Electronics, Manufacturing, Networks, Telecommunications, Microelectronics, Very large scale integration, Integrated circuits, Computer aided design, System on a chip

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PROCEEDINGS ARTICLE | November 19, 2001

Fully digital pixel readout architecture with a current-mode A/D converter

Proc. SPIE. 4593, Design, Characterization, and Packaging for MEMS and Microelectronics II

KEYWORDS: Mirrors, Imaging systems, Sensors, Indium, Imaging devices, Microelectronics, Transistors, Intelligence systems, Analog electronics, Digital electronics

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PROCEEDINGS ARTICLE | November 19, 2001

Massively parallel per-pixel-based zerotree processing architecture for real-time video compression

Proc. SPIE. 4593, Design, Characterization, and Packaging for MEMS and Microelectronics II

KEYWORDS: Logic, Clocks, Image processing, Wavelets, Discrete wavelet transforms, Signal processing, Video compression, Quantization, Multimedia, Signal detection

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PROCEEDINGS ARTICLE | May 30, 2000

CMOS circuit for high-speed flexible read-out of CMOS imagers

Proc. SPIE. 4067, Visual Communications and Image Processing 2000

KEYWORDS: Clocks, Imaging systems, Image processing, Silicon, Very large scale integration, Transistors, CMOS technology, Computer aided design, Digital electronics, Flexible circuits

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PROCEEDINGS ARTICLE | October 8, 1999

Noise analysis of MESFET gallium arsenide circuits

Proc. SPIE. 3893, Design, Characterization, and Packaging for MEMS and Microelectronics

KEYWORDS: Logic, Switching, Gallium arsenide, Microelectronics, Very large scale integration, Transistors, Integrated circuits, Field effect transistors, Digital electronic circuits, Digital electronics

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PROCEEDINGS ARTICLE | October 8, 1999

Asynchronous techniques for digital MESFET gallium arsenide circuits

Proc. SPIE. 3893, Design, Characterization, and Packaging for MEMS and Microelectronics

KEYWORDS: Logic, Clocks, Gallium arsenide, Control systems, Microelectronics, Transistors, Field effect transistors, Logic devices, Signal generators, Digital electronics

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PROCEEDINGS ARTICLE | September 29, 1999

3D packaging technology for vision CMOS VLSI: review and performance evaluation

Proc. SPIE. 3891, Electronics and Structures for MEMS

KEYWORDS: Switching, Imaging systems, Sensors, Image processing, Very large scale integration, CMOS technology, Analog electronics, Digital electronics, 3D vision, 3D image processing

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PROCEEDINGS ARTICLE | January 27, 1998

Two-dimensional smart arrays for collision avoidance

Proc. SPIE. 3207, Intelligent Transportation Systems

KEYWORDS: Photodetectors, Parallel processing, Motion detection, Very large scale integration, Smart sensors, Collision avoidance

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PROCEEDINGS ARTICLE | February 17, 1997

Status of recent developments in collision avoidance using motion detectors based on insect vision

Proc. SPIE. 2902, Transportation Sensors and Controls: Collision Avoidance, Traffic Management, and ITS

KEYWORDS: Visual process modeling, Visualization, Sensors, Motion detection, Very large scale integration, Receptors, Motion models, Statistical modeling, Eye models, Collision avoidance

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PROCEEDINGS ARTICLE | December 19, 1996

Two-dimensional motion detector based on insect vision

Proc. SPIE. 2950, Advanced Focal Plane Arrays and Electronic Cameras

KEYWORDS: Photodetectors, Optical amplifiers, Visual process modeling, Sensors, Interference (communication), Motion detection, Very large scale integration, Analog electronics, Motion models, Digital electronics

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PROCEEDINGS ARTICLE | December 27, 1995

Biologically inspired obstacle avoidance: a technology-independent paradigm

Proc. SPIE. 2591, Mobile Robots X

KEYWORDS: Infrared detectors, Infrared sensors, Extremely high frequency, Visual process modeling, Visualization, Sensors, Gallium arsenide, Very large scale integration, Infrared radiation, Digital electronics

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PROCEEDINGS ARTICLE | January 6, 1995

New VLSI smart sensor for collision avoidance inspired by insect vision

Proc. SPIE. 2344, Intelligent Vehicle Highway Systems

KEYWORDS: Infrared sensors, Photodetectors, Visualization, Sensors, Gallium arsenide, Very large scale integration, Intelligence systems, CCD image sensors, Smart sensors, Collision avoidance

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Showing 5 of 24 publications

Conference Committee Involvement (5)

VLSI Circuits and Systems

2 May 2007 | Maspalomas, Gran Canaria, Spain

VLSI Circuits and Systems II

9 May 2005 | Sevilla, Spain

Smart Structures, Devices, and Systems II

13 December 2004 | Sydney, Australia

Microelectronics: Design, Technology, and Packaging

10 December 2003 | Perth, Australia

VLSI Circuits and Systems

19 May 2003 | Maspalomas, Gran Canaria, Canary Islands, Spain

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