Co-packaged optics for next-generation data center switches require novel photonic packaging and optical interconnect solutions to increase bandwidth and decrease manufacturing costs. An optoelectronic glass substrate with integrated ion-exchanged (IOX) single-mode waveguides for photonic integrated circuit (PIC) packaging and fiber cable connectivity is demonstrated in an effort to reduce the overall packaging complexity. The single-mode glass waveguides were fabricated and evaluated to be thermally stable at 110ºC for more than 5 years. Laser singulated optical end-facets and laser-formed passive alignment features yield an average connector loss of 0.68 dB when end-coupled to standard MTP- 16™ connectors.
Access to the requested content is limited to institutions that have purchased or subscribe to SPIE eBooks.
You are receiving this notice because your organization may not have SPIE eBooks access.*
*Shibboleth/Open Athens users─please
sign in
to access your institution's subscriptions.
To obtain this item, you may purchase the complete book in print or electronic format on
SPIE.org.
INSTITUTIONAL Select your institution to access the SPIE Digital Library.
PERSONAL Sign in with your SPIE account to access your personal subscriptions or to use specific features such as save to my library, sign up for alerts, save searches, etc.