Dr. Kee-Keun Lee
at Ajou Univ
SPIE Involvement:
Conference Program Committee | Author
Publications (14)

PROCEEDINGS ARTICLE | March 7, 2014
Proc. SPIE. 8975, Reliability, Packaging, Testing, and Characterization of MOEMS/MEMS, Nanodevices, and Nanomaterials XIII
KEYWORDS: Gold, Reflectors, Resonators, Sensors, Metals, Reflectivity, Wave propagation, Antennas, Gyroscopes, Acoustics

PROCEEDINGS ARTICLE | March 9, 2013
Proc. SPIE. 8614, Reliability, Packaging, Testing, and Characterization of MOEMS/MEMS and Nanodevices XII
KEYWORDS: Packaging, Photovoltaics, Microlens array, Etching, Quartz, Glasses, Solar cells, Chromium, CCD cameras, Microlens

PROCEEDINGS ARTICLE | February 15, 2012
Proc. SPIE. 8250, Reliability, Packaging, Testing, and Characterization of MEMS/MOEMS and Nanodevices XI
KEYWORDS: Fabrication, Microlens array, Etching, Quartz, Polymers, Chromium, Scanning electron microscopy, Refraction, Microlens, Photorefractive polymers

PROCEEDINGS ARTICLE | February 28, 2011
Proc. SPIE. 7928, Reliability, Packaging, Testing, and Characterization of MEMS/MOEMS and Nanodevices X
KEYWORDS: Refractive index, Microlens array, Etching, Quartz, Polymers, Coating, Chromium, Microlens, Spherical lenses, Photorefractive polymers

PROCEEDINGS ARTICLE | February 28, 2011
Proc. SPIE. 7928, Reliability, Packaging, Testing, and Characterization of MEMS/MOEMS and Nanodevices X
KEYWORDS: Sensors, Biosensors, Wave propagation, Signal generators, Gyroscopes, Velocity measurements, Acoustics, Semiconducting wafers, Wave propagation interference, Network security

PROCEEDINGS ARTICLE | February 28, 2011
Proc. SPIE. 7928, Reliability, Packaging, Testing, and Characterization of MEMS/MOEMS and Nanodevices X
KEYWORDS: Gold, Reflectors, Polymethylmethacrylate, Reflection, Signal attenuation, Reflectivity, Biosensors, Acoustics, Network security, Phase shifts

Showing 5 of 14 publications
Conference Committee Involvement (5)
Reliability, Packaging, Testing, and Characterization of MOEMS/MEMS, Nanodevices, and Nanomaterials XIII
3 February 2014 | San Francisco, California, United States
Reliability, Packaging, Testing, and Characterization of MOEMS/MEMS and Nanodevices XII
4 February 2013 | San Francisco, California, United States
Reliability, Packaging, Testing, and Characterization of MEMS/MOEMS and Nanodevices XI
23 January 2012 | San Francisco, California, United States
Reliability, Packaging, Testing, and Characterization of MEMS/MOEMS and Nanodevices X
24 January 2011 | San Francisco, California, United States
Reliability, Packaging, Testing, and Characterization of MEMS/MOEMS and Nanodevices IX
25 January 2010 | San Francisco, California, United States
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