Dr. Keming Du
Managing Director/Founder at EdgeWave GmbH
SPIE Involvement:
Conference Program Committee | Author
Publications (39)

PROCEEDINGS ARTICLE | February 19, 2018
Proc. SPIE. 10520, Laser-based Micro- and Nanoprocessing XII
KEYWORDS: Beam splitters, Diffractive optical elements, Copper, Laser processing, Laser engraving, Parallel processing, Laser ablation, Head, Ultrafast lasers, Micromachining, Bragg cells, Pulsed laser operation

PROCEEDINGS ARTICLE | February 3, 2015
Proc. SPIE. 9255, XX International Symposium on High-Power Laser Systems and Applications 2014
KEYWORDS: Mirrors, Resonators, Polarization, Crystals, Solid state lasers, Wave plates, Raman spectroscopy, Laser resonators, Beam shaping, Pulsed laser operation

PROCEEDINGS ARTICLE | February 18, 2012
Proc. SPIE. 8244, Laser-based Micro- and Nanopackaging and Assembly VI
KEYWORDS: Optical amplifiers, Metals, High power lasers, Copper, Laser processing, Surface roughness, Laser engraving, Laser ablation, Picosecond phenomena, Pulsed laser operation

PROCEEDINGS ARTICLE | March 4, 2011
Proc. SPIE. 7912, Solid State Lasers XX: Technology and Devices
KEYWORDS: Mirrors, Optical amplifiers, Oscillators, Resonators, Crystals, Amplifiers, Semiconductor lasers, Picosecond phenomena, Neodymium lasers, Pulsed laser operation

PROCEEDINGS ARTICLE | March 4, 2011
Proc. SPIE. 7912, Solid State Lasers XX: Technology and Devices
KEYWORDS: Second-harmonic generation, Resonators, Ultraviolet radiation, Crystals, Nd:YAG lasers, Near field, Beam shaping, Harmonic generation, Temperature metrology, Absorption

PROCEEDINGS ARTICLE | February 21, 2011
Proc. SPIE. 7921, Laser-based Micro- and Nanopackaging and Assembly V
KEYWORDS: Semiconductors, Thin films, Photovoltaics, Solar energy, Glasses, Ultraviolet radiation, Laser ablation, Thin film solar cells, Transparent conductors, Absorption

Showing 5 of 39 publications
Conference Committee Involvement (2)
Lasers in Material Processing and Manufacturing III
12 November 2007 | Beijing, China
Lasers in Material Processing and Manufacturing II
10 November 2004 | Beijing, China
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