Dr. Ken Gall
at Georgia Institute of Technology
SPIE Involvement:
Author
Publications (5)

Proceedings Article | 28 March 2012
Proc. SPIE. 8342, Behavior and Mechanics of Multifunctional Materials and Composites 2012
KEYWORDS: Mathematical modeling, Numerical simulations, 3D modeling, Numerical analysis, Finite element methods, Beam shaping, Chemical elements, Thermodynamics, Process modeling, Shape memory alloys

Proceedings Article | 6 January 2006
Proc. SPIE. 6111, Reliability, Packaging, Testing, and Characterization of MEMS/MOEMS V
KEYWORDS: Microelectromechanical systems, Gold, Oxides, Microsystems, Etching, Metals, Silicon, Chemistry, Corrosion, Picosecond phenomena

Proceedings Article | 5 May 2005
Proc. SPIE. 5762, Smart Structures and Materials 2005: Industrial and Commercial Applications of Smart Structures Technologies
KEYWORDS: Packaging, Actuators, Foam, Polymers, Composites, Antennas, Space operations, Smart materials, Shape memory polymers, Temperature metrology

Proceedings Article | 23 December 2003
Proc. SPIE. 5343, Reliability, Testing, and Characterization of MEMS/MOEMS III
KEYWORDS: Microelectromechanical systems, Gold, Thin films, Annealing, Copper, Ceramics, Silicon, Diffusion, Polysomnography, Temperature metrology

Proceedings Article | 14 June 2000
Proc. SPIE. 3992, Smart Structures and Materials 2000: Active Materials: Behavior and Mechanics
KEYWORDS: Crystals, Physics, Transmission electron microscopy, Solids, Finite element methods, Mechanical engineering, Crystallography, Systems modeling, Thermodynamics, Shape memory alloys

Conference Committee Involvement (3)
Reliability, Packaging, Testing, and Characterization of MEMS/MOEMS V
25 January 2006 | San Jose, California, United States
Reliability, Packaging, Testing, and Characterization of MEMS/MOEMS IV
25 January 2005 | San Jose, California, United States
Reliability, Testing, and Characterization of MEMS/MOEMS III
26 January 2004 | San Jose, California, United States
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