Dr. Kevin Lucas
Product Engineering manager at Synopsys Inc
SPIE Involvement:
Conference Program Committee | Author | Instructor
Publications (137)

Proceedings Article | 23 March 2020
Proc. SPIE. 11323, Extreme Ultraviolet (EUV) Lithography XI
KEYWORDS: Lithography, Data modeling, Calibration, Image processing, Monte Carlo methods, Extreme ultraviolet lithography, Optical proximity correction, Critical dimension metrology, Failure analysis, Stochastic processes

Proceedings Article | 23 March 2020
Proc. SPIE. 11328, Design-Process-Technology Co-optimization for Manufacturability XIV
KEYWORDS: Lithography, Optical lithography, Visualization, Silicon, Design for manufacturing, Semiconducting wafers, Process modeling, Device simulation

Proceedings Article | 21 March 2019
Proc. SPIE. 10961, Optical Microlithography XXXII
KEYWORDS: Lithography, Optical lithography, Data modeling, Calibration, 3D modeling, Photoresist materials, Photoresist developing

Proceedings Article | 20 March 2019
Proc. SPIE. 10962, Design-Process-Technology Co-optimization for Manufacturability XIII
KEYWORDS: Lithography, Data modeling, Calibration, 3D modeling, Printing, Photomasks, Machine learning, Optical proximity correction, Semiconducting wafers

Proceedings Article | 8 October 2018
Proc. SPIE. 10810, Photomask Technology 2018
KEYWORDS: Lithography, Optical lithography, Data modeling, 3D modeling, Photoresist materials, Photomasks, Optical proximity correction, Photoresist processing, Semiconducting wafers, Photoresist developing

Showing 5 of 137 publications
Conference Committee Involvement (4)
Design-Technology Co-optimization XV
21 February 2021 | San Jose, California, United States
Design-Process-Technology Co-optimization for Manufacturability XIV
26 February 2020 | San Jose, California, United States
Design-Process-Technology Co-optimization for Manufacturability XIII
27 February 2019 | San Jose, California, United States
Optical Microlithography XXXI
27 February 2018 | San Jose, California, United States
Course Instructor
SC540: Applying Optical Proximity Correction and Design for Manufacturability to Product Designs
Optical proximity correction (OPC) is now a requirement for advanced semiconductor manufacturing. OPC alters the designed layout to compensate for systematic patterning distortions and/or to implement process latitude improving methods. Accurate and practical model-based OPC implementation is needed with essentially all lithography resolution enhancement techniques (RET) on complex real world designs. This practical example-oriented class will prepare attendees to implement manufacturable rule and model-based OPC on their product designs and introduce them to optimized OPC, design & process solution methods known as lithographic Design for Manufacturability (DFM).
SC990: Optical Proximity Correction for Current and Future Nodes
Optical proximity correction (OPC) and reticle enhancement techniques (RET) are fundamental requirements for advanced semiconductor manufacturing. OPC is a class of techniques which alter the design layout in order to: compensate for systematic patterning distortions; implement process latitude improving methods (i.e., RET); and verify mask pattern correctness. Accurate and practical rule-based or model-based OPC methods are needed to correctly implement essentially all advanced lithography extensions (e.g., sub-resolution assist features, double patterning, EUV) on complex real world designs. This practical example-oriented class will help prepare attendees to understand, implement and validate manufacturable rule and model-based OPC on their product designs.
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