Proceedings Article | 13 May 2010
KEYWORDS: Semiconducting wafers, Polymers, Modulation transfer functions, Glasses, Reliability, Ultraviolet radiation, Wafer-level optics, Tolerancing, Cameras, Metrology
The Anteryon WaferOptics® Technology platform contains imaging optics designs, materials, metrologies
and combined with wafer level based Semicon & MEMS production methods. WaferOptics® first required complete
new system engineering. This system closes the loop between application requirement specifications, Anteryon product
specification, Monte Carlo Analysis, process windows, process controls and supply reject criteria. Regarding the
Anteryon product Integrated Lens Stack (ILS), new design rules, test methods and control systems were assessed,
implemented, validated and customer released for mass production. This includes novel reflowable materials, mastering
process, replication, bonding, dicing, assembly, metrology, reliability programs and quality assurance systems. Many of
Design of Experiments were performed to assess correlations between optical performance parameters and machine
settings of all process steps. Lens metrologies such as FFL, BFL, and MTF were adapted for wafer level production and
wafer mapping was introduced for yield management. Test methods for screening and validating suitable optical
materials were designed. Critical failure modes such as delamination and popcorning were assessed and modeled with
FEM. Anteryon successfully managed to integrate the different technologies starting from single prototypes to high yield
mass volume production These parallel efforts resulted in a steep yield increase from 30% to over 90% in a 8 months
period.
