Mr. Konstantinos Stamoulis
at
SPIE Involvement:
Author
Publications (1)

PROCEEDINGS ARTICLE | January 22, 2005
Proc. SPIE. 5716, Reliability, Packaging, Testing, and Characterization of MEMS/MOEMS IV
KEYWORDS: Packaging, Gold, Thin films, Digital signal processing, Interfaces, Silicon, Surface roughness, Semiconducting wafers, Wafer bonding, Temperature metrology

SIGN IN TO:
  • View contact details

UPDATE YOUR PROFILE
Is this your profile? Update it now.
Don’t have a profile and want one?

Back to Top