In the paper we discuss crucial aspects of selective deep wet etching technology of fused silica optical fibers.
The technology includes preparation of the fiber, photolithography aiming to create a mask for etching, wet etching
process and photoresist removal. We also discuss the influence of removing polyimide layer from the fiber, photoresist
type, thickness of the photoresist and etching time. The developed technology allows for obtaining periodic variations in
the fiber diameter resulting in formation of corrugated long-period grating (LPG). Introduction of strain induces
appearing of attenuation peak in the transmission spectrum of the fiber. The developed technology can be also applied
for fabrication of other optical fiber devices.