As patterning dimensions decrease, die yield and performance become increasingly sensitive to smaller
amounts of process variations. To minimize variability, Process Control is applied to prevent excursions,
improve yield, decrease non-product runs, reduce cycle time due to rework, and reduce equipment
calibration and maintenance. Intel inline Process Control aims at rapid detection, classification, prediction,
and correction of problems and/or non-optimal performance during wafer processing. For efficient process
control, robust analysis is needed in order to monitor the process, detect, and predict the process behavior.
The paper will address Intel model based control and will focus on the various model based analysis and
control modules that Intel has developed, and deployed for different technology generations. With the rapid
increases in the number of analysis and control modules and the emerging need for integrating such
modules to allow sharing of data, applications and methods, there is a need to define standard interfaces for
such modules. This need motivated Intel to lead the development of SEMI E133; the Process Control
Systems (PCS) Standard that was approved on October 2003.