With the drastic data traffic requirements of Internet, the demand of high bandwidth optical communication for local-area-network (LAN) and storage-area-network (SAN) are increasing. A novel design of Z-axis pluggable 4x10Gb/s fiber-optic transceiver module, which owns the advantages of high port density, low cost, thermal stability and compact size is studied in this paper. The Xenpak-like transceiver modules with 4 channels LC type connectors are designed in the Xenpak mechanical dimension specified in Xenpak Multi-Source Agreement (MSA) to accomplish signal transmission. The Xenpak-like 850nm transceiver modules make use of the 70-way two-row electrical connector, which is originally designed for 10Gigabit Extended Attachment Unit Interface (XAUI), to transmit and receive the 4x10G/bs signal. A signal compensated circuit would be not only implemented to solve and overcome the loss and distortion of the connector interface but to improve signal integrity of 10Gb/s data transmitted over 100mm distance with standard FR4 printed circuit board. Moreover, in order to improve the performance of high-density printed circuit, the effects of electromagnetic interference (EMI) will also consider and discuss in this study. The optical performance of each lane of transceiver module is evaluated to pass the requirements of 10Gigabit Ethernet, respectively. The transmit eye diagram of each lane in the Xenpak-like transceiver modules is tested compliant with 10GE eye mask. And the extinction ratio of each transmitter is also evaluated above 3.5dB, averagely. Besides, the receiver sensitivity of each lane is demonstrated below -11dBm. To fulfill the future traffic demand of Ethernet, the authors have provided an alternative and novel design of 4x10Gb/s transceiver module for LAN/SAN applications.
This paper describes a 12-channels parallel optical transmitter module with a MPO-Connector designed for a very short reach OC-192 and SNAP 12 specifications. It is important to design the micro array lens for better couple efficiency of array optical transmitter module. The authors design the high accuracy micro array lens for injection modeling to reduce the price and suit for further mass production. In this 12-channel parallel optical transmitter module, it is very difficult to posit the chip on correct position according to guide pin or guide pin hole. Therefore, the authors develop the method of two steps flip chip bonding to release the difficulty of chip alignment on ceramic substrate without two guide pin holes. The performance of the module is demonstrated to fulfill the requirements of SNAP 12. The extinction ratio of the 12-channels array transmitter module is tested above 6dB, respectively. The optical shift by heat is an important factor affecting the performance of the array module. Thermal analysis of 12-channel parallel optical transmitter module is used to improve the effect of optical shift by heat in this paper. And the temperature among the case of transmitter module is greatly reduced from 52.7 degree to 31.9 degree. In this paper, a 12-channel array transmitter module package and thermal simulation are discussed and tested. This is a low cost package design and is suitable for mass production.
With the drastic expansion of internet usage, the demand of 10Gbps transmission optoelectronic devices for local-area-network (LAN) and storage-area-network (SAN) are increasing. The key issues of these applications are to improve cost, manufacturability and reliability of optoelectronic devices in high speed transmission. The authors have demonstrated highly manufacturable and reliable optical front end and trasneiver module for 10Gbps Ethernet applications in this paper.
TO-Can package is a way to reduce cost of 10Gbps optical assembly. However, the signal integrity of high speed transmitter optical sub-assembly (TOSA) and receiver optical sub-assembly (ROSA) are limited due to the mismatched characteristic impedance, parasitic inductance and spread capacitance of conventional TO-Can package. In this paper, high performance and high sensitivity of 10Gbps TOSA and ROSA with TO-Can package are discussed and demonstrated to overcome the critical issues mentioned, respectively. In order to improve the signal integrity and manufacturability of 10Gbps OSA in 10Gigabit Ethernet small form factor transceiver module assembly. The authors also integrate high speed flex board and OSA package to extend the signal path, and to minimize the effect of crosstalk in module.
The high speed transceiver modules with TO-Can package embedded compliant with XFP multi-source agreement (MSA) are also demonstrated in this paper. The performance of temperature-stabilized transceiver module over awide case temperature range is tested. The optical eye diagram of 10Gbps transmitter developed in this study shows an excellent quality passing the 10Gbps Ethernet mask test between 0 degrees Centigrade and to 70 degrees Centigrade. Finally, the reliability tests regulated by Telcordia GR-468-CORE and MIL-STD-883 are also performed and certified to pave the ways of highly manufacturable and reliable XFP transceiver modules for 10Gbps Ethernet applications.
In this paper, manufacturing issues include Optical Sub-Assembly (OSA), Electrical Sub-Assembly (ESA) and reliability considerations of 10 Gb/s Ethernet transponder were studied by using experiments and implementation. In the growing optical communication industry, one of the star products is the Z-axis pluggable optical transceiver module. Under the broad usage of Ethernet means high port density, low cost, high utilities, compact size and still require excellent performance. After standardizing of 10 Gb/s ethernet (IEEE 802.3ae), many transceiver companies, silicon vendors and system vendors reached the agreement and signed up diversity of MSA (Multi-Source Agreement). These MSAs still keep modifying with system demands, customer requirements, cost and performance issue. This paper presents how to achieve these functions description in the MSA and own a highly manufacturability and reliability module design. According to composed block of transponder, we split it into OSA, ESA, mechanical design and related reliability experimental result. In the OSA, traditional TO-CAN package and optical components be introduced. Because the mature manufacture experience, vendor can easy to meet low cost and manufacturability requirements and only need to slightly modifications. A simply solution be implemented to solve this problem and discuss the critical point of the design. Thermal issue on OSA will also be mentioned because of the sensitive of light source and how to calculate the effect to find effective solutions. By the way, some manufacturability criteria will be discussed for OSA characteristics in 10 Gb/s applications. In the ESA, PMD (Physical media dependant) driving methods, Multi-Source Agreement related digital optical monitor function implement and performance comparison will be presented. On the other hand, we will examine the crosstalk effect between transmitter and receiver circuit and impact to the module Optical to Electrical convert interface design. We still need to take well-assembly between OSA and ESA into consideration. Perfect assembly will lead us to earn wonderful reliability and manufacturability. In the mechanical design, many reliability and maufacturability issue need to consider such as thermal, EMI, temperature, humidity effect etc. So, module mechanical design must be highly collocation with ESA, OSA, heat spreader and special EMI shielding design. Experimental data and thermal simulation result are also prepared to guide us forward to a successful product.