Kunal Vaed
at IBM Corp
SPIE Involvement:
Author
Publications (1)

PROCEEDINGS ARTICLE | December 30, 2003
Proc. SPIE. 5342, Micromachining and Microfabrication Process Technology IX
KEYWORDS: Copper, Silicon, Micromachining, Capacitance, Semiconducting wafers, Dielectrics, Etching, Deep reactive ion etching, Microelectronics, Resistance

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