Laser processing in the market is required with high precision and fast speed in large area without stop. In order to do this technology, it is essential to synchronize scanner and stage and it is able to process large area exceeding optical field size by scan lens. Additionally, this processing is very important to stabilize and optimize optical system such as laser optic and vision for high precision and fast speed. So, we developed a complex laser processing system for cutting and drilling etc, and then we tested various laser applications using the developed complex laser processing system. So in this paper, the various functions and performance of the developed complex laser processing system are described, and the laser application results will be introduced.
As industry of PCB (Printed Circuit Board) and display growing, this industry requires an increasingly high-precision quality so current cutting process in industry is preferred laser machining than mechanical machining. Now, laser machining is used almost “step and repeat” method in large area, but this method has a problem such as cutting quality in the continuity of edge parts, cutting speed and low productivity. To solve these problems in large area, on-the-fly (stagescanner synchronized system) is gradually increasing. On-the-fly technology is able to process large area with high speed because of stage-scanner synchronized moving. We designed laser-based high precision system with on-the-fly. In this system, we used UV nano-second pulse laser, power controller and scanner with telecentric f-theta lens. The power controller is consisted of HWP(Half Wave Plate), thin film plate polarizer, photo diode, micro step motor and control board. Laser power is possible to monitor real-time and adjust precision power by using power controller. Using this machine, we tested cutting of large area coverlay and sheet type large area PCB by applying on-the-fly. As a result, our developed machine is possible to process large area without the problem of the continuity of edge parts and by high cutting speed than competitor about coverlay.
Recently, PCB(Printed Circuit Board) is required more high precision, function and miniaturization for advanced
electronics, display, semiconductor and packaging, etc. and this complex PCB needs cutting, repair, trimming and
structuring, etc. So, we make complex machine that is possible this all PCB processing and test PCB material processing
using developed machine. This machine consists of UV nano-second pulse laser, power controller(self-developments),
probe stage for trimming, auto focusing and scanner. The power controller is possible to monitor real-time power and
adjust precision laser power. Using various parameters such as laser power, scanning speed, repetition rate and pulsed
overlaps can obtain for process result having high precision and speed.