Laurent Le Cam
Product Manager/DfM at NXP Semiconductors
SPIE Involvement:
Author
Publications (10)

PROCEEDINGS ARTICLE | March 11, 2010
Proc. SPIE. 7641, Design for Manufacturability through Design-Process Integration IV
KEYWORDS: Semiconductors, Lithography, Databases, Metals, Manufacturing, Design for manufacturing, System on a chip, Model-based design, Chemical mechanical planarization, Design for manufacturability

PROCEEDINGS ARTICLE | November 16, 2007
Proc. SPIE. 6730, Photomask Technology 2007
KEYWORDS: Diffraction, Lithographic illumination, Scattering, 3D modeling, Near field, Photomasks, Optical proximity correction, Semiconducting wafers, Systems modeling, Near field optics

PROCEEDINGS ARTICLE | May 14, 2007
Proc. SPIE. 6607, Photomask and Next-Generation Lithography Mask Technology XIV
KEYWORDS: Lithography, Optical lithography, Silicon, Inspection, Printing, Photomasks, Optical simulations, Optical proximity correction, SRAF, Semiconducting wafers

PROCEEDINGS ARTICLE | May 3, 2007
Proc. SPIE. 6533, 23rd European Mask and Lithography Conference
KEYWORDS: Semiconductors, Reticles, Metrology, Cadmium, Metals, Manufacturing, Optical proximity correction, Critical dimension metrology, Photoresist processing, Semiconducting wafers

PROCEEDINGS ARTICLE | March 27, 2007
Proc. SPIE. 6520, Optical Microlithography XX
KEYWORDS: Logic, Optical lithography, Polarization, Scanners, Printing, Transistors, Double patterning technology, Optical proximity correction, System on a chip, Resolution enhancement technologies

PROCEEDINGS ARTICLE | March 27, 2007
Proc. SPIE. 6520, Optical Microlithography XX
KEYWORDS: Semiconductors, Lithium, Optical lithography, Polarization, 3D modeling, Information technology, Photomasks, Optical proximity correction, Semiconducting wafers, Process modeling

Showing 5 of 10 publications
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