A study was preformed to explore the possibility of using Isothermal Solidification technique for sealing medium preparation in wafer level vacuum/hermetic package of MEMS/NEMS devices and to examine the effect of plasma treatment and bonding environment on the shear strength of the sealed structure. Appropriate plasma treatment can improve the bonding strength of the sealing structure and optimized parameters were obtained. The bonding strength of the sample bonded in vacuum environment is larger than in other environments. The hermeticity of the sealed structure was also evaluated. Preliminary results show that the sealed structure can satisfy the hermetic package criterion of MIL STD 883E.
A novel self-aligning SIOB (SIlicon Optical Bench) for fully passive alignment of optical components is proposed for integrated transceiver modules. The coupling efficiency from laser diode directly to fiber is about 8% in theory because of severe mode mismatch and large NA difference. To pursue high coupling efficiency, a ball lens is added between laser diode and fiber. The calculations and simulations are done to optimize the optical system according to optical component specifications. The coupling efficiency is up to 45%. We designed the layout and fabricated the SIOB in (100) silicon wafer to obtain the demanding cavities by MEMS technology.