Mr. Lei Yu Profile

Lei Yu

at SIMIT

SPIE Involvement:

Author

Publications (1)

This will count as one of your downloads.

You will have access to both the presentation and article (if available).

DOWNLOAD NOW

This content is available for download via your institution's subscription. To access this item, please sign in to your personal account.

Email or Username Forgot your username?

Password Forgot your password?

Show

Keep me signed in

No SPIE account? Create an account

Proceedings Article | 12 October 2016 Paper

Development and application of a new CMP slurry for phase change memory

Lei Yu, Weili Liu, Bo Liu, Zhitang Song

Proceedings Volume 9818, 98180X (2016) https://doi.org/10.1117/12.2248154

KEYWORDS: Chemical mechanical planarization, Silica, Semiconducting wafers, Surface finishing, Polishing, Abrasives, Scanning electron microscopy, Oxides, Manufacturing, Dielectrics

Read Abstract +

In this paper, the development of a new chemical mechanical planarization (CMP) slurry for phase change material GeSbTe (GST) and its application in the manufacturing process of phase change memory based on GST is presented. The basic abrasive of the slurry was special colloid silica which was chosen from several kinds of colloid silica with different surface treatment and stable pH range. Oxidizer, chelator, inhibitor and protective agent were added to the colloid silica to accelerate the polishing rate and protect the surface. A series of CMP experiments were carried out on a 4-inch experimental platform to confirm and optimize the performance of the slurry with different ratio of reagents. After the recipe was frozen, the slurry was used in the CMP process of manufacturing the phase change memory on 12-inch wafers. The results on blanket wafers show that the remove rate, endurance life, residue control is at the same level with those of the old slurry, while the scratch control is much better than that of the old one. The final results on both metal line structure and blade structure show that the new slurry has much better performance than the old one on oxide loss, scratch and erosion control.

My Library

You currently do not have any folders to save your paper to! Create a new folder below.

Folder Name

Folder Description

View contact details

UPDATE YOUR PROFILE

Is this your profile? Update it now.

Sign into your SPIE.org account

Don’t have a profile and want one?

Create an account on SPIE.org

Access to the requested content is limited to institutions that have purchased or subscribe to SPIE eBooks. You are receiving this notice because your organization may not have SPIE eBooks access.*

*Shibboleth/Open Athens users─please sign in to access your institution's subscriptions.

To obtain this item, you may purchase the complete book in print or electronic format on SPIE.org.

ORGANIZATIONAL
Sign in with credentials provided by your organization.

Organizational Username

Organizational Password

Show/Hide Password

INSTITUTIONAL
Select your institution to access the SPIE Digital Library.

SELECT YOUR INSTITUTION

PERSONAL
Sign in with your SPIE account to access your personal subscriptions or to use specific features such as save to my library, sign up for alerts, save searches, etc.

PERSONAL SIGN IN

No SPIE Account? Create one

PURCHASE THIS CONTENT

SUBSCRIBE TO DIGITAL LIBRARY

50 downloads per 1-year subscription

Members: $195

Non-members: $335 ADD TO CART

25 downloads per 1 - year subscription

Members: $145

Non-members: $250 ADD TO CART

PURCHASE SINGLE ARTICLE

Includes PDF, HTML & Video, when available

Members:

Non-members: ADD TO CART

Keywords/Phrases

Search In:

Publication Years