Dr. Leland J. Spangler Profile

Dr. Leland J. Spangler

at Aspen Technologies Inc

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Author

Publications (2)

Proceedings Article | 23 December 2003 Paper

Assembly process issues and reliability in microsystem packaging

Leland Spangler

Proceedings Volume 5343, (2003) https://doi.org/10.1117/12.531901

KEYWORDS: Microsystems, Reliability, Semiconducting wafers, Gold, Adhesives, Metals, Packaging, Optical inspection, Microelectromechanical systems, Materials processing

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Proceedings Article | 20 May 1996 Paper

Smart sensor for automotive passive restraint systems

Leland Spangler, Christopher Kemp

Proceedings Volume 2722, (1996) https://doi.org/10.1117/12.240438

KEYWORDS: Sensors, Calibration, Clocks, Reliability, Digital electronics, Modulators, Signal processing, Smart sensors, Microelectronics, Switches

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