Ms. Lena Goullon Profile

Lena Goullon

at Fraunhofer IZM

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Proceedings Article | 9 March 2015 Paper

Large area LED package

L. Goullon, R. Jordan, T. Braun, J. Bauer, Karl Friedrich Becker, M. Hutter, M. Schneider-Ramelow, K.-D. Lang

Proceedings Volume 9383, 93831A (2015) https://doi.org/10.1117/12.2079380

KEYWORDS: Light emitting diodes, Copper, Semiconducting wafers, LED lighting, Light sources, Adhesives, Glasses, Silicon, Solid state lighting, Packaging

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Solid state lighting using LED-dies is a rapidly growing market. LED-dies with the needed increasing luminous flux per chip area produce a lot of heat. Therefore an appropriate thermal management is required for general lighting with LEDdies. One way to avoid overheating and shorter lifetime is the use of many small LED-dies on a large area heat sink (down to 70 μm edge length), so that heat can spread into a large area while at the same time light also appears on a larger area. The handling with such small LED-dies is very difficult because they are too small to be picked with common equipment. Therefore a new concept called collective transfer bonding using a temporary carrier chip was developed. A further benefit of this new technology is the high precision assembly as well as the plane parallel assembly of the LED-dies which is necessary for wire bonding. It has been shown that hundred functional LED-dies were transferred and soldered at the same time. After the assembly a cost effective established PCB-technology was applied to produce a large-area light source consisting of many small LED-dies and electrically connected on a PCB-substrate. The top contacts of the LED-dies were realized by laminating an adhesive copper sheet followed by LDI structuring as known from PCB-via-technology. This assembly can be completed by adding converting and light forming optical elements. In summary two technologies based on standard SMD and PCB technology have been developed for panel level LED packaging up to 610x 457 mm2 area size.

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