We demonstrate the feasibility of producing advanced silicon photonic devices for future data communication nodes at 40Gbps using CMOS compatible processes in a 300mm wafer fab. Basic building blocks are shown together with various wavelength division multiplexing solutions. All the devices presented are integrated on 220nm SOI or locally grown epitaxial germanium.
Development of fast silicon photonics integrated circuit is mainly driven by the reduction of the power consumption. As a result, photodetectors with high efficiency, high speed and low dark current are needed to reduce the global link consumption. Germanium is now considered as the ideal candidate for fully integrated receivers based on SOI substrate and CMOS-like processes. We report on low power and high speed waveguide-integrated Ge photodetectors. Butt coupled lateral PIN structure photodiodes have been fabricated by Germanium selective growth and ion implantation at the end of silicon waveguide. Three types of photodiodes are reported, with dark current as low as 6nA at 1V reverse bias, optical bandwidth over 40GHz at zero bias and responsivity up to 0.8A/W at a wavelength of 1550nm. Such devices are suitable for data rate over 40Gbps and can be easily integrated with other photonic devices to fabricate wafer scale integrated circuits for datacom and telecom applications.
We report a Germanium lateral pin photodiode integrated with selective epitaxy at the end of silicon waveguide.
A very high optical bandwidth estimated at 120GHz is shown, with internal responsivity as high as 0.8A/W at
1550nm wavelength. Open eye diagram at 40Gb/s was obtained under zero-bias at wavelength of 1.55μm.