Lewis A. Binns
Principal Physicist at ASML Netherlands BV
SPIE Involvement:
Author
Area of Expertise:
Overlay Metrology , Machine vision , Software development , Semiconductor Metrology , Image Processing , Systems integration
Websites:
Publications (19)

Proceedings Article | 22 March 2008
Proc. SPIE. 6922, Metrology, Inspection, and Process Control for Microlithography XXII
KEYWORDS: Wafer-level optics, Data modeling, Calibration, Etching, Scanners, Optical testing, Process control, Photomasks, Semiconducting wafers, Overlay metrology

Proceedings Article | 22 March 2008
Proc. SPIE. 6922, Metrology, Inspection, and Process Control for Microlithography XXII
KEYWORDS: Radar, Signal to noise ratio, Reticles, Metrology, Calibration, Image processing, Reflectivity, Diagnostics, Semiconducting wafers, Overlay metrology

Proceedings Article | 22 March 2008
Proc. SPIE. 6922, Metrology, Inspection, and Process Control for Microlithography XXII
KEYWORDS: Diffraction, Reticles, Data modeling, Scanners, Reflectivity, Time metrology, Process control, Semiconducting wafers, Tolerancing, Overlay metrology

Proceedings Article | 5 April 2007
Proc. SPIE. 6518, Metrology, Inspection, and Process Control for Microlithography XXI
KEYWORDS: Lithography, Metrology, Calibration, Manufacturing, Photomasks, Semiconducting wafers, Optical calibration, Optics manufacturing, Overlay metrology, Standards development

Proceedings Article | 5 April 2007
Proc. SPIE. 6518, Metrology, Inspection, and Process Control for Microlithography XXI
KEYWORDS: Mathematical modeling, Reticles, Data modeling, Calibration, Error analysis, Process control, Semiconducting wafers, Tolerancing, Wafer testing, Overlay metrology

Showing 5 of 19 publications
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