Recently, more and more attention has been paid on the multispectral imaging for its excellent resolution capability in
the complex environment. For this reason, various sensors for multispectral imaging has been developed. Generally,
these sensors contain a visible light Focal Plane Array for visible light imaging and an IR Focal Plane Array for IR
imaging with the CCD or CMOS readout circuit to output the signal. In this paper, a novel monolithic visible light
(400nm-800nm) / IR (1μm-5μm) charge coupled device (CCD) focal plane array sensor was designed. This sensor was
fabricated using 2 micron design rule and a double level poly silicon with four phase transfer structure. The especial
design of the device was that it integrated the visible light sensitive cells and IR sensitive cells on a single chip with the
PN junction photodiode for the visible light signal detecting and the PtSi Schottky-barrier diode for the IR signal
detecting. The number of PN junction photodiode and PtSi Schottky-barrier diode arrayed in offset intersection were all
512(H)×256(V), so the hole number of the pixels were 512(H)×512(V). The device was operated in interleaved scanning
mode, the visible light signal and IR signal was exported in odd filed and even field respectively. This sensor was an
interline-transfer CCD with an on-chip amplifier which was used to read out the video at 12.5 MHz to provide standard
30 frames per second format. The test result shows that this sensor was succeed in visible light / IR multispectral
imaging worked at the temperature of 77K.
Visible light / IR CCD Focal Plane Array has an excellent potential application foreground for its wide spectral response.
It can be replaced the two separated systems for visible light imaging and IR imaging. For this reason, it can be
decreased the complexity of the camera system and reduced the cost.
Integrated visible/infrared dual-band filter array is the key component of compact, lightweight, rigid miniature dual-band
CCD sensing system. Interference cut-off filter array and interference absorbing filter array have been designed for
infrared and visible pass band respectively. A simple, effective and compatible with high temperature deposition process
lift-off technique for striping thick infrared film was investigated. Integrating photolithography, ion beam assisted
electron beam physical vapor deposition and improved lift-off process, dual-band microfilter array with good
performance was fabricated on the same sapphire substrate consecutively. Details of design and fabricating procedure are
elucidated, and experimental results are presented.
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