Optical switch is one of key supporting technologies in all-optical-network (AON). And electrostatic MOEMS (Micro-Optical-Electro-Mechanical Systems) switch plays a very important role in all the researched switches, because of their excellent features, including low insertion, low crosstalk and scalability. But the packaging technology has been limiting the development of optical switch. In this paper, the authors study the laser beam propagating during the free space and select collimator, design the pedestal to packaging and address aspects of the insertion loss that are most important loss mechanisms for the 2D cross-connect switch.
Arrays of micro-sized LEDs which can be used as microdisplays have been demonstrated in recent years. In order to reduce the input and output connections to the arrays, we employ a matrix addressable architecture, in which all the pixels in each row are connected by a common metal line on the top of the window layer (top electrode) or at the base of substrate(bottom electrode). Decreasing the size of electrodes makes for minimizing the size of device. The optic and electronic isolation and good ohmic contact are also helpful to obtain superior optical and electrical performance. We describe a procedure of fabrication of AlGaInP-based orange micro-LED by wet etching. The structure of devices is etched using both isotropic and anisotropic solvent. The pixel size is about 16um x 20um, and there are 1000 x 818 pixels in the light emitting chip whose diagonal is 1-in.