Optical systems used in aerospace applications are often subject to random vibrations excited by internal and external forces; these range from engine vibrations in airborne systems to gravity and wind forces for ground-based systems. These random motions cause optical elements to shift position, thereby impacting their imaging performance and leading to lower image resolution or image registration errors. Vibration jitter analysis is a method by which such performance degradation can be quantified, and it guides the opto-mechanical design of the system. However, such jitter analysis can be very challenging, as it often incorporates data exchange among several commercial software packages or in-house codes. In this paper we proposed a multiphysics jitter analysis workflow to analyze jitter induced performance impact in optical system using the Ansys Zemax OpticStudio STAR Module and Ansys Mechanical. Ansys mechanical performs finite element analysis of the optical system under field condition. The structural and thermal information is then passed back to Zemax OpticStudio STAR module to analysis the optical performance degradation. Two main jitter impacts are considered: the slow jitter effects due to temperature gradients and the fast jitter effects due to random vibration. The insight gained from this analysis will help guide optical system packaging design to achieve better performance on the system level.
Optical inspection systems allow faster detection of defects on semiconductor wafers than scanning electron microscopy (SEM) inspection systems. However, optical detection becomes more challenging as the structure feature size shrinks below the optical diffraction limit with the advancement of technology nodes in semiconductor manufacturing. To overcome this challenge and achieve optimal performance, the optical system must be tailored to the specific characteristics of the wafer sample which requires knowledge of the underlying microscopic and macroscopic optical phenomena. In this work, we proposed a multiphysics simulation workflow to model the microscopic light interaction with the wafer sample using Ansys Lumerical FDTD and the macroscopic optics of the inspection system using Ansys Zemax OpticStudio. The optimum optical system design with maximum defect signal strength could be achieved through defect image analysis. Together, FDTD and OpticStudio facilitate the design of complex optical inspection systems and reduce the cycle time for creating inspection recipes in the development of advanced technology nodes in semiconductor manufacturing.
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