To solve some problems of silicon micro-cantilevers etching rate and quality, a new method which combines laser
micromachining processes and micro-electromechanical systems (MEMS) is adopted to fabricate silicon microcantilevers.
The experimental results show that the laser etching technology provides an excellent alternative approach to
release silicon micro-cantilever beams from silicon substrate with low cost, high etching rate, precision of operation, and
design flexibility, which avoiding convex corner undercutting in etching of micro-cantilevers. This study also provides a
new method of laser etching technology for the fabrication of other microstructures.