Lutz Hofmann
Research Staff for 3D-TSV Integration of MEMS at Fraunhofer-Institut für Elektronische Nanosysteme
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Publications (2)

Proceedings Article | 21 May 2015
Proc. SPIE. 9517, Smart Sensors, Actuators, and MEMS VII; and Cyber Physical Systems
KEYWORDS: Semiconducting wafers, Microelectromechanical systems, Wafer bonding, Glasses, Copper, Etching, CMOS technology, Sensors, Metals, Silicon

Proceedings Article | 1 March 2006
Proc. SPIE. 6105, Free-Space Laser Communication Technologies XVIII
KEYWORDS: Receivers, Modulation, Modulators, Dense wavelength division multiplexing, Interference (communication), Eye, Binary data, Numerical simulations, Time division multiplexing, Dispersion

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