Lutz Hofmann
Research Staff for 3D-TSV Integration of MEMS at Fraunhofer-Institut für Elektronische Nanosysteme
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Publications (2)

Proceedings Article | 21 May 2015
Proc. SPIE. 9517, Smart Sensors, Actuators, and MEMS VII; and Cyber Physical Systems
KEYWORDS: Microelectromechanical systems, Sensors, Etching, Metals, Glasses, Copper, Silicon, CMOS technology, Semiconducting wafers, Wafer bonding

Proceedings Article | 1 March 2006
Proc. SPIE. 6105, Free-Space Laser Communication Technologies XVIII
KEYWORDS: Eye, Modulation, Dispersion, Interference (communication), Numerical simulations, Receivers, Modulators, Time division multiplexing, Dense wavelength division multiplexing, Binary data

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