In recent years, demand for high-density integration of semiconductor chips has steadily increased due to miniaturization and high-performance requirements of electronics including Smartphones and Tablet PCs. In addition to 3D integration using Through-Silicon Via (TSV) technology, 2.5D integration technology using silicon interposers has also become a hot topic. Canon has identified key challenges that must be solved for successful implementation of high-density integration technologies into mass production and to meet these challenges, Canon developed the FPA-5510iV i-line lithography tool (stepper) that is now in wide use at customer sites for their most challenging processes. In this paper, Canon will explain details of FPA-5510iV features that support high-density integration. Canon will also introduce additional challenges that must be solved to ensure the success of high-density integration technologies in mass production, as well as Canon efforts to solve the remaining challenges.