This paper discusses postponement strategy applied to the Daphnis 10μm products family designed on purpose for postponement and for performing late-stage product completion as close to demands as possible. Regarding individual building blocks, DAPHNIS generic parts are created during the initial stages of the manufacturing process. In the later stages, these generic parts are customized to create the final product.
Recent advances in miniaturization of IR imaging technology have led to a growing market for mini thermal-imaging
sensors. In that respect, Sofradir development on smaller pixel pitch has made much more compact products available to
the users. When this competitive advantage is mixed with smaller coolers, made possible by HOT technology, we
achieved valuable reductions in the size, weight and power of the overall package. At the same time, we are moving
towards a global offer based on digital interfaces that provides our customers simplifications at the IR system design
process while freeing up more space. This paper discusses recent developments on hot and small pixel pitch technologies
as well as efforts made on compact packaging solution developed by SOFRADIR in collaboration with CEA-LETI.