Dr. Ming Mao
at IMEC
SPIE Involvement:
Author
Publications (15)

PROCEEDINGS ARTICLE | April 17, 2018
Proc. SPIE. 10589, Advanced Etch Technology for Nanopatterning VII
KEYWORDS: Carbon, Lithography, Etching, Chemistry, Scanning electron microscopy, Photoresist materials, Line width roughness, Plasma enhanced chemical vapor deposition, Extreme ultraviolet lithography, Line edge roughness

PROCEEDINGS ARTICLE | March 23, 2018
Proc. SPIE. 10583, Extreme Ultraviolet (EUV) Lithography IX
KEYWORDS: Optical lithography, Etching, Metals, Copper, Resistance, Photomasks, Extreme ultraviolet, Critical dimension metrology, Semiconducting wafers, Tin

PROCEEDINGS ARTICLE | March 21, 2018
Proc. SPIE. 10583, Extreme Ultraviolet (EUV) Lithography IX
KEYWORDS: Logic, Optical lithography, Etching, Scanning electron microscopy, Photomasks, Extreme ultraviolet, SRAF, Photoresist processing, Stochastic processes, Tin

PROCEEDINGS ARTICLE | March 20, 2018
Proc. SPIE. 10589, Advanced Etch Technology for Nanopatterning VII
KEYWORDS: Semiconductors, Optical lithography, Metals, Scanning electron microscopy, Photoresist materials, Extreme ultraviolet, Extreme ultraviolet lithography, High volume manufacturing, Line edge roughness, Back end of line

PROCEEDINGS ARTICLE | April 26, 2017
Proc. SPIE. 10148, Design-Process-Technology Co-optimization for Manufacturability XI
KEYWORDS: Logic, Optical lithography, Etching, Metals, Photomasks, Extreme ultraviolet, Semiconductor manufacturing, Computational lithography, Optical proximity correction, SRAF

PROCEEDINGS ARTICLE | March 27, 2017
Proc. SPIE. 10146, Advances in Patterning Materials and Processes XXXIV
KEYWORDS: Oxides, Optical lithography, Etching, Metals, Photoresist materials, Extreme ultraviolet lithography, Photoresist processing, System on a chip, Plasma, Tin

Showing 5 of 15 publications
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