This paper illustrates a novel MEMS technology that allows the creation of a multiple axis actuator / sensor trough deep
silicon etching and wafer bonding techniques. As example a dual axis rotational high-stroke MEMS actuator is presented. This device can integrate a mirror to realize a device used, for example, in fully optical multiplexer. Microfabrication technology derives from our previous works and it’s based on deep silicon trench techniques as well as on wafer bonding capabilities. More over the resulting assembly after the wafer bonding is machined to proceed on
realizing the complete MEMS device.
Hard Disk Drives (HDD) are the most widely used data-storage medium. The Track Per Inch (TPI) limit is related to mechanical resonances of the positioning arm and to low frequency bearing effect. A secondary actuator must be able to position precisely with higher bandwidth the Read/Write (RW) head with respect to the magnetic track with any interference with the magnetic data recorded on the disk. MEMS technology allows the fabrication of such electrostatic microactuator for the secondary stage in the HDD. The paper presents the basics requirements for the secondary actuator for the HDD as well as the process developed to fulfill those. Accurate calculation and FEM simulation are required to lead to high performance and robust design. After the built a deep experimental analysis is ducted to confirm and refine design parameters.