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Marcus Dankelmann
Senior Staff Engineer Lithography at Infineon Technologies Dresden
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Publications (2)
Proceedings Article | 4 September 2015 Paper
Investigations for an alternative to contact angle measurement after Hexamethyldisilazane deposition
H. Aßmann, A. Krause, R. Maurer, M. Dankelmann, M. Specht, W. Usry, R. Newcomb
Proceedings Volume 9661, 96610L (2015) https://doi.org/10.1117/12.2196955
KEYWORDS: Semiconducting wafers, Head-mounted displays, Wafer testing, Silicon, Lithography, Oxides, Plasma enhanced chemical vapor deposition, Image processing, Wet etching, Etching
Proceedings Article | 28 March 2014 Paper
Litho resist rework influences on Cu metal layer patterning with TiN-hard mask
Marcus Dankelmann, Markus Czekalla, Heiko Estel, Jens Hahn, Bee Kim Hong, Mario Lamm, Eric Neubert, Michael Renner, Rainer Scheibel, Maik Stegemann, Jens Schneider
Proceedings Volume 9054, 90540P (2014) https://doi.org/10.1117/12.2045307
KEYWORDS: Etching, Oxygen, Photoresist processing, Semiconducting wafers, Photomasks, Metals, Plasma, Tin, Critical dimension metrology, Chemistry
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